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MC33662BSEFR2

MC33662BSEFR2

LTB
NXP USA Inc.

LIN PHYSICAL LAYER, 7 V TO 18 V SUPPLY, 20 KBAUD, -40 °C TO 125 °C, NSOIC-8

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MC33662BSEFR2

MC33662BSEFR2

LTB
NXP USA Inc.

LIN PHYSICAL LAYER, 7 V TO 18 V SUPPLY, 20 KBAUD, -40 °C TO 125 °C, NSOIC-8

Find alt

Description

General part information

MC33662 Series

MC33662BSEFR2 is an ISO 17987/LIN 2.x/SAEJ2602-2 LIN physical layer. The local interconnect network (LIN) is a serial communication protocol, designed to support automotive networks in conjunction with a CAN. As the lowest level of a hierarchical network, LIN enables cost-effective communication with sensors and actuators when all the features of CAN are not required. This integrates a fast baud rate (above 100Kbps), as reported by the RXD pin for test and programming modes. This provides excellent EMC and Radiated Emission performance, ESD robustness, and safe behavior, in the event of a LIN bus short-to-ground, or a LIN bus leakage during low-power mode. This device is powered by SMARTMOS technology. The application includes body electronics (BCM, gateway, roof, door, lighting, HVAC), powertrain (EMS, start and stop), BMS, safety, and Chassis (TPMS, seat belt).

Technical Specifications

Parameters and characteristics for this part

SpecificationMC33662BSEFR2
Data Rate20 kbps
Mounting TypeSurface Mount
Number of Drivers1
Number of Receivers1
Operating Temperature (Max)125 °C
Operating Temperature (Min)-40 °C
Package Length0.154 in
Package Name8-SOIC
Package Width3.9 mm
ProtocolLINbus
TypeTransceiver
Voltage - Supply (Maximum)18 V
Voltage - Supply (Minimum)7 V

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