130-028-000

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CONN IC DIP SOCKET 28POS GOLD

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CONN IC DIP SOCKET 28POS GOLD

Technical Specifications

Parameters and characteristics for this part

Specification	130-028-000

Contact Finish - Mating	Gold
Contact Finish - Post	Gold
Contact Finish Thickness - Mating	0.203 Ám
Contact Finish Thickness - Mating	8 Áin
Contact Finish Thickness - Post	Flash
Contact Material - Mating	Beryllium Copper
Contact Material - Post [custom]	Brass
Current Rating (Amps)	1 A
Features	Open Frame
Housing Material	Polyphenylene Sulfide (PPS), Glass Filled
Material Flammability Rating	UL94 V-0
Mounting Type	Through Hole
Number of Positions or Pins (Grid)	28
Operating Temperature [Max]	125 °C
Operating Temperature [Min]	-65 ░C
Pitch - Mating	0.1 in
Pitch - Mating	2.54 mm
Pitch - Post	2.54 mm
Pitch - Post	0.1 in
Termination	Solder
Termination Post Length	3.2 mm
Termination Post Length	0.126 in
Type	0.3 "
Type	7.62 mm
Type	DIP

CONN IC DIP SOCKET 28POS GOLD

Part	Operating Temperature [Max]	Operating Temperature [Min]	Features	Number of Positions or Pins (Grid)	Contact Finish Thickness - Post	Material Flammability Rating	Contact Finish - Mating	Termination Post Length	Termination Post Length	Pitch - Post	Pitch - Post	Mounting Type	Type	Type	Type	Contact Material - Post [custom]	Current Rating (Amps)	Contact Material - Mating	Pitch - Mating	Pitch - Mating	Contact Finish - Post	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Termination	Housing Material
3M 130-028-000	125 °C	-65 ░C	Open Frame	28	Flash	UL94 V-0	Gold	3.2 mm	0.126 in	2.54 mm	0.1 in	Through Hole	0.3 "	7.62 mm	DIP	Brass	1 A	Beryllium Copper	0.1 in	2.54 mm	Gold	0.203 Ám	8 Áin	Solder	Polyphenylene Sulfide (PPS), Glass Filled

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

General part information

28 (2 x 14) Pos DIP, 0.3" (7.62mm) Row Spacing Socket Gold Through Hole

Technical documentation and resources

No documents available