Part	Insulation Height	Insulation Material	Contact Length - Mating	Pitch - Mating	Connector Type	Contact Finish - Post	Style	Insulation Color	Mounting Type	Contact Material	Shrouding	Contact Type	Contact Finish - Mating	Number of Rows	Material Flammability Rating	Contact Shape	Number of Positions	Termination	Number of Positions Loaded	Features	Fastening Type	Operating Temperature (Min)	Operating Temperature (Max)	Row Spacing - Mating	Contact Finish Thickness - Mating
Samtec Inc. TSM-111-02-T-SV-A	0.1 in	Liquid Crystal Polymer (LCP)	0.32 in	0.1 in	Cuttable Header	Tin	Board Board or Cable	Black	Surface Mount	Phosphor Bronze	Unshrouded	Male Pin	Tin	1	UL94 V-0	Square	11	Solder	All	Board Guide	Push-Pull	-55 °C	105 °C
Samtec Inc. TSM-111-01-S-DH-A-P-TR	0.24 in	Liquid Crystal Polymer (LCP)	0.23 in	0.1 in	Header	Tin	Board Board or Cable	Black	Right Angle Surface Mount	Phosphor Bronze	Unshrouded	Male Pin	Gold	2	UL94 V-0	Square	22	Solder	All	Board Guide Pick and Place	Push-Pull	-55 °C	125 °C	0.1 in	30 µin
Samtec Inc. TSM-111-01-L-DV-A-P	0.1 in	Liquid Crystal Polymer (LCP)	0.23 in	0.1 in	Cuttable Header	Tin	Board Board or Cable	Black	Surface Mount	Phosphor Bronze	Unshrouded	Male Pin	Gold	2	UL94 V-0	Square	22	Solder	All	Board Guide Pick and Place	Push-Pull	-55 °C	125 °C	0.1 in	10 µin
Samtec Inc. TSM-111-01-S-SH-P	0.12 in	Liquid Crystal Polymer (LCP)	0.23 in	0.1 in	Header	Tin	Board Board or Cable	Black	Right Angle Surface Mount	Phosphor Bronze	Unshrouded	Male Pin	Gold	1	UL94 V-0	Square	11	Solder	All	Pick and Place	Push-Pull	-55 °C	125 °C		30 µin
Samtec Inc. TSM-111-03-SM-DV-A-P	0.1 in	Liquid Crystal Polymer (LCP)	0.42 in	0.1 in	Cuttable Header	Tin	Board Board or Cable	Black	Surface Mount	Phosphor Bronze	Unshrouded	Male Pin	Gold	2	UL94 V-0	Square	22	Solder	All	Board Guide Pick and Place	Push-Pull	-55 °C	125 °C	0.1 in	30 µin
Samtec Inc. TSM-111-01-L-SH-P	0.12 in	Liquid Crystal Polymer (LCP)	0.23 in	0.1 in	Header	Tin	Board Board or Cable	Black	Right Angle Surface Mount	Phosphor Bronze	Unshrouded	Male Pin	Gold	1	UL94 V-0	Square	11	Solder	All	Pick and Place	Push-Pull	-55 °C	125 °C		10 µin
Samtec Inc. TSM-111-01-TL-DV	0.1 in	Liquid Crystal Polymer (LCP)	0.23 in	0.1 in	Cuttable Header	Tin	Board Board or Cable	Black	Surface Mount	Phosphor Bronze	Unshrouded	Male Pin	Tin	2	UL94 V-0	Square	22	Solder	All		Push-Pull	-55 °C	105 °C	0.1 in
Samtec Inc. TSM-111-04-T-SV-P-TR	0.1 in	Liquid Crystal Polymer (LCP)	0.12 in	0.1 in	Cuttable Header	Tin	Board Board or Cable	Black	Surface Mount	Phosphor Bronze	Unshrouded	Male Pin	Tin	1	UL94 V-0	Square	11	Solder	All	Pick and Place	Push-Pull	-55 °C	105 °C
Samtec Inc. TSM-111-01-F-DV-A	0.1 in	Liquid Crystal Polymer (LCP)	0.23 in	0.1 in	Cuttable Header	Tin	Board Board or Cable	Black	Surface Mount	Phosphor Bronze	Unshrouded	Male Pin	Gold	2	UL94 V-0	Square	22	Solder	All	Board Guide	Push-Pull	-55 °C	125 °C	0.1 in	3 µin
Samtec Inc. TSM-111-02-TL-DV	0.1 in	Liquid Crystal Polymer (LCP)	0.32 in	0.1 in	Cuttable Header	Tin	Board Board or Cable	Black	Surface Mount	Phosphor Bronze	Unshrouded	Male Pin	Tin	2	UL94 V-0	Square	22	Solder	All		Push-Pull	-55 °C	105 °C	0.1 in

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TSM-111-03-T-SV | Datasheet