W987D6HBGX6E
ActiveWinbond Electronics
IC DRAM 128MBIT PAR 54VFBGA
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W987D6HBGX6E
ActiveWinbond Electronics
IC DRAM 128MBIT PAR 54VFBGA
Deep-Dive with AI
DocumentsDatasheet
Technical Specifications
Parameters and characteristics commom to parts in this series
| Specification | W987D6HBGX6E | W987D6 Series |
|---|---|---|
| Access Time | 5.4 ns | 5.4 ns |
| Clock Frequency | 166 MHz | 133 - 166 MHz |
| Memory Format | DRAM | DRAM |
| Memory Interface | Parallel | Parallel |
| Memory Organization | 8M x 16 | 8M x 16 |
| Memory Size | 128 Mb | 128 Mb |
| Memory Type | Volatile | Volatile |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature [Max] | 85 °C | 85 °C |
| Operating Temperature [Min] | -25 °C | -40 - -25 °C |
| Package / Case | 54-TFBGA | 54-TFBGA |
| Supplier Device Package | 54-VFBGA (8x9) | 54-VFBGA (8x9) |
| Technology | SDRAM - Mobile LPSDR | SDRAM - Mobile LPSDR |
| Voltage - Supply [Max] | 1.95 V | 1.95 V |
| Voltage - Supply [Min] | 1.7 V | 1.7 V |
| Write Cycle Time - Word, Page | 15 ns | 15 ns |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
W987D6 Series
IC DRAM 128MBIT PAR 54VFBGA
| Part | Write Cycle Time - Word, Page | Access Time | Operating Temperature [Min] | Operating Temperature [Max] | Memory Interface | Technology | Voltage - Supply [Max] | Voltage - Supply [Min] | Supplier Device Package | Package / Case | Memory Organization | Memory Size | Clock Frequency | Mounting Type | Memory Type | Memory Format |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Winbond Electronics W987D6HBGX6E TR | 15 ns | 5.4 ns | -25 °C | 85 °C | Parallel | SDRAM - Mobile LPSDR | 1.95 V | 1.7 V | 54-VFBGA (8x9) | 54-TFBGA | 8M x 16 | 128 Mb | 166 MHz | Surface Mount | Volatile | DRAM |
Winbond Electronics W987D6HBGX6I | 15 ns | 5.4 ns | -40 °C | 85 °C | Parallel | SDRAM - Mobile LPSDR | 1.95 V | 1.7 V | 54-VFBGA (8x9) | 54-TFBGA | 8M x 16 | 128 Mb | 166 MHz | Surface Mount | Volatile | DRAM |
Winbond Electronics W987D6HBGX6I TR | 15 ns | 5.4 ns | -40 °C | 85 °C | Parallel | SDRAM - Mobile LPSDR | 1.95 V | 1.7 V | 54-VFBGA (8x9) | 54-TFBGA | 8M x 16 | 128 Mb | 166 MHz | Surface Mount | Volatile | DRAM |
Winbond Electronics W987D6HBGX6E | 15 ns | 5.4 ns | -25 °C | 85 °C | Parallel | SDRAM - Mobile LPSDR | 1.95 V | 1.7 V | 54-VFBGA (8x9) | 54-TFBGA | 8M x 16 | 128 Mb | 166 MHz | Surface Mount | Volatile | DRAM |
Winbond Electronics W987D6HBGX7E | 15 ns | 5.4 ns | -25 °C | 85 °C | Parallel | SDRAM - Mobile LPSDR | 1.95 V | 1.7 V | 54-VFBGA (8x9) | 54-TFBGA | 8M x 16 | 128 Mb | 133 MHz | Surface Mount | Volatile | DRAM |
Description
General part information
W987D6 Series
SDRAM - Mobile LPSDR Memory IC 128Mbit Parallel 166 MHz 5.4 ns 54-VFBGA (8x9)
Documents
Technical documentation and resources