IC DRAM 128MBIT PAR 54VFBGA
Part | Write Cycle Time - Word, Page | Access Time | Operating Temperature [Min] | Operating Temperature [Max] | Memory Interface | Technology | Voltage - Supply [Max] | Voltage - Supply [Min] | Supplier Device Package | Package / Case | Memory Organization | Memory Size | Clock Frequency | Mounting Type | Memory Type | Memory Format |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Winbond Electronics W987D6HBGX6E TR | 15 ns | 5.4 ns | -25 °C | 85 °C | Parallel | SDRAM - Mobile LPSDR | 1.95 V | 1.7 V | 54-VFBGA (8x9) | 54-TFBGA | 8M x 16 | 128 Mb | 166 MHz | Surface Mount | Volatile | DRAM |
Winbond Electronics W987D6HBGX6I | 15 ns | 5.4 ns | -40 °C | 85 °C | Parallel | SDRAM - Mobile LPSDR | 1.95 V | 1.7 V | 54-VFBGA (8x9) | 54-TFBGA | 8M x 16 | 128 Mb | 166 MHz | Surface Mount | Volatile | DRAM |
Winbond Electronics W987D6HBGX6I TR | 15 ns | 5.4 ns | -40 °C | 85 °C | Parallel | SDRAM - Mobile LPSDR | 1.95 V | 1.7 V | 54-VFBGA (8x9) | 54-TFBGA | 8M x 16 | 128 Mb | 166 MHz | Surface Mount | Volatile | DRAM |
Winbond Electronics W987D6HBGX6E | 15 ns | 5.4 ns | -25 °C | 85 °C | Parallel | SDRAM - Mobile LPSDR | 1.95 V | 1.7 V | 54-VFBGA (8x9) | 54-TFBGA | 8M x 16 | 128 Mb | 166 MHz | Surface Mount | Volatile | DRAM |
Winbond Electronics W987D6HBGX7E | 15 ns | 5.4 ns | -25 °C | 85 °C | Parallel | SDRAM - Mobile LPSDR | 1.95 V | 1.7 V | 54-VFBGA (8x9) | 54-TFBGA | 8M x 16 | 128 Mb | 133 MHz | Surface Mount | Volatile | DRAM |