Specification	D17760BP200ADV

A/D Channels	4 count
A/D Resolution (bits)	10 bit
Connectivity	EMI, FIFO, EBI, SCI, Memory Card, Serial Sound, USB, SIM, MFI, SPI, I2C, CANbus, Audio Codec
Core Configuration	Single-Core
Core Processor	SH-4
Core Size (Bit Width)	32 Bit
Mounting Type	Surface Mount
Number of I/O	69
Operating Temperature (Max)	85 °C
Operating Temperature (Min)	-40 °C
Oscillator Type	Internal
Package / Case	256-LFBGA
Package Length	17 mm
Package Name	256-LFBGA
Package Width	17 mm
Peripherals	WDT, LCD, POR, DMA
Program Memory Type	ROMless
RAM Size Depth	48 K
RAM Size Width	8 bit
Speed	200 MHz
Voltage - Supply (Vcc/Vdd) Maximum	1.6 V
Voltage - Supply (Vcc/Vdd) Minimum	1.4 V

D17760 Series

Part	Core Size (Bit Width)	Core Configuration	Peripherals	Core Processor	Package / Case	Program Memory Type	Operating Temperature (Max)	Operating Temperature (Min)	Oscillator Type	A/D Channels	A/D Resolution (bits)	Package Name	Package Width	Package Length	Mounting Type	Voltage - Supply (Vcc/Vdd) Maximum	Voltage - Supply (Vcc/Vdd) Minimum	Connectivity	RAM Size Depth	RAM Size Width	Speed	Number of I/O
Renesas Electronics Corporation D17760BP200ADV	32 Bit	Single-Core	DMA LCD POR WDT	SH-4	256-LFBGA	ROMless	85 °C	-40 °C	Internal	4 count	10 bit	256-LFBGA	17 mm	17 mm	Surface Mount	1.6 V	1.4 V	Audio Codec CANbus EBI EMI FIFO I2C Memory Card MFI SCI Serial Sound SIM SPI USB	48 K	8 bit	200 MHz	69

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