HTSW-123-23-G-T

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Samtec Inc.

CONN UNSHROUDED HEADER HDR 69 POS 2.54MM SOLDER ST TOP ENTRY THRU-HOLE BULK

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HTSW-123-23-G-T

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Samtec Inc.

CONN UNSHROUDED HEADER HDR 69 POS 2.54MM SOLDER ST TOP ENTRY THRU-HOLE BULK

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Technical Specifications

Parameters and characteristics for this part

Specification	HTSW-123-23-G-T

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HTSW-123 Series

Part	Termination	Pitch - Mating	Pitch - Mating	Mounting Type	Contact Finish - Post	Current Rating (Amps)	Insulation Height	Insulation Height	Row Spacing - Mating [x]	Row Spacing - Mating [x]	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Connector Type	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Length - Post [x]	Contact Length - Post	Contact Material	Insulation Material	Shrouding	Material Flammability Rating	Contact Shape	Operating Temperature [Min]	Operating Temperature [Max]	Overall Contact Length	Overall Contact Length	Insulation Color	Contact Type	Style	Number of Positions	Contact Length - Mating	Contact Length - Mating	Contact Finish - Mating	Fastening Type	Number of Positions Loaded	Number of Rows	Contact Length - Mating [x]	Contact Length - Mating [x]	Contact Length - Post
Samtec Inc. HTSW-123-15-G-D
Samtec Inc. HTSW-123-23-S-D
Samtec Inc. HTSW-123-19-G-D	Solder	0.1 in	2.54 mm	Through Hole	Gold	Varies by Wire Gauge	0.1 in	2.54 mm	2.54 mm	0.1 in	3 µin	0.076 µm	Header	10 çin	0.25 çm	0.11 in	2.79 mm	Phosphor Bronze	Liquid Crystal Polymer (LCP)	Unshrouded	UL94 V-0	Square	-55 °C	125 °C	1.03 in	26.16 mm	Natural	Male Pin	Board to Board Cable	46	20.83 mm	0.82 in	Gold	Push-Pull	All	2
Samtec Inc. HTSW-123-08-G-D
Samtec Inc. HTSW-123-14-T-D	Solder	0.1 in	2.54 mm	Through Hole	Tin	Varies by Wire Gauge	0.1 in	2.54 mm	2.54 mm	0.1 in			Header			0.11 in	2.79 mm	Phosphor Bronze	Liquid Crystal Polymer (LCP)	Unshrouded	UL94 V-0	Square	-55 °C	105 ░C	0.53 in	13.46 mm	Natural	Male Pin	Board to Board Cable	46	8.13 mm	0.32 in		Push-Pull	All	2
Samtec Inc. HTSW-123-15-F-D-LL	Kinked Pin Solder	0.1 in	2.54 mm	Through Hole	Tin	Varies by Wire Gauge	0.1 in	2.54 mm	2.54 mm	0.1 in			Header	3 µin	0.076 µm	0.11 in	2.79 mm	Phosphor Bronze	Liquid Crystal Polymer (LCP)	Unshrouded	UL94 V-0	Square	-55 °C	125 °C	0.73 in	18.54 mm	Natural	Male Pin	Board to Board Cable	46			Gold	Push-Pull	All	2	13.21 mm	0.52 in
Samtec Inc. HTSW-123-30-G-T
Samtec Inc. HTSW-123-07-S-S	Solder	0.1 in	2.54 mm	Through Hole	Tin	Varies by Wire Gauge	0.1 in	2.54 mm					Header	30 Áin	0.76 Ám		2.54 mm	Phosphor Bronze	Liquid Crystal Polymer (LCP)	Unshrouded	UL94 V-0	Square	-55 °C	125 °C	0.43 in	10.92 mm	Natural	Male Pin	Board to Board Cable	23	5.84 mm		Gold	Push-Pull	All	1		0.23 in	0.1 in
Samtec Inc. HTSW-123-23-G-T
Samtec Inc. HTSW-123-15-L-D	Solder	0.1 in	2.54 mm	Through Hole	Tin	Varies by Wire Gauge	0.1 in	2.54 mm	2.54 mm	0.1 in			Header	10 çin	0.25 çm	0.11 in	2.79 mm	Phosphor Bronze	Liquid Crystal Polymer (LCP)	Unshrouded	UL94 V-0	Square	-55 °C	125 °C	0.73 in	18.54 mm	Natural	Male Pin	Board to Board Cable	46			Gold	Push-Pull	All	2	13.21 mm	0.52 in

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Arrow	N/A	1	$ 8.24
		10	$ 7.61
		25	$ 7.20
		50	$ 6.94
		100	$ 5.29
Digikey	Bulk	1	$ 8.24

Description

General part information

HTSW-123 Series

Connector Header position

Documents

Technical documentation and resources