RB088T-40NZC9
ActiveRohm Semiconductor
SUPER LOW IR, 40V, 10A, ITO-220AB, SCHOTTKY BARRIER DIODE
RB088T-40NZC9
ActiveRohm Semiconductor
SUPER LOW IR, 40V, 10A, ITO-220AB, SCHOTTKY BARRIER DIODE
Description
General part information
RB088T-40NZ Series
RB088T-40NZ is super low IRschottky barrier diode for switching power supply.
Technical Specifications
Parameters and characteristics for this part
| Specification | RB088T-40NZC9 |
|---|---|
| Current - Average Rectified (Io) (per Diode) | 10 A |
| Current - Reverse Leakage | 3 µA |
| Diode Configuration | Common Cathode |
| Diode Pair Count | 1 pair |
| Mounting Type | Through Hole |
| Operating Temperature - Junction | 150 °C |
| Package / Case | TO-220-3 Full Pack |
| Package Name | TO-220FN |
| Speed - Fast Recovery (Maximum) | 500 ns |
| Speed - Fast Recovery (Minimum) | 200 mA |
| Technology | Schottky |
| Voltage - DC Reverse (Vr) (Max) | 40 V |
| Voltage - Forward (Vf) (Max) | 770 mV |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
Sign in to see pricing
Create a free account to access distributor pricing data.
CAD
3D models and CAD resources for this part
Documents
Technical documentation and resources
Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)
Absolute Maximum Rating and Electrical Characteristics of Diodes
Judgment Criteria of Thermal Evaluation
Notes for Calculating Power Consumption:Static Operation
Compliance of the RoHS directive
Notes for Temperature Measurement Using Forward Voltage of PN Junction
Taping Information
Power Loss and Thermal Design of Diodes
Importance of Probe Calibration When Measuring Power: Deskew
Certificate of not containing SVHC under REACH Regulation
About Export Regulations
Method for Calculating Junction Temperature from Transient Thermal Resistance Data
Inner Structure
Basics of Thermal Resistance and Heat Dissipation
Reliability Test Result
Moisture Sensitivity Level - Diodes
θ<sub>JA</sub> and Ψ<sub>JT</sub>
Condition of Soldering / Land Pattern Reference
Part Explanation
Explanation for Marking
Package Dimensions
RB088T-40NZ Data Sheet
PCB Layout Thermal Design Guide
Impedance Characteristics of Bypass Capacitor
How to Use LTspice® Models
Precautions When Measuring the Rear of the Package with a Thermocouple
Anti-Whisker formation - Diodes
Method for Monitoring Switching Waveform
What is a Thermal Model? (Diode)
ROHM's SBD Lineup Contributes to Greater Miniaturization and Lower Loss in Automotive, Industrial, and Consumer Equipment
Two-Resistor Model for Thermal Simulation
Measurement Method and Usage of Thermal Resistance RthJC
List of Diode Package Thermal Resistance
Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials
About Flammability of Materials
How to Select Reverse Current Protection Diodes for LDO Regulators
θ<sub>JC</sub> and Ψ<sub>JT</sub>
Diode Selection Method for Asynchronous Converter
Notes for Temperature Measurement Using Thermocouples
Diode Types and Applications
ESD Data
What Is Thermal Design
How to Select Rectifier Diodes
How to Use LTspice® Models: Tips for Improving Convergence
How to Use the Thermal Resistance and Thermal Characteristics Parameters
How to Create Symbols for PSpice Models