Specification	XLF224-512-FB374-I40

Core Count	24 Core
Core Processor	XCore
Core Size (Bit Width)	32 Bit
Mounting Type	Surface Mount
Number of I/O	176
Operating Temperature (Max)	85 °C
Operating Temperature (Min)	-40 °C
Oscillator Type	External
Package / Case	374-LFBGA
Package Length	18 mm
Package Name	374-FBGA
Package Width	18 mm
Program Memory Depth	2 M
Program Memory Size	2 MB
Program Memory Type	FLASH
Program Memory Width	8 bit
RAM Size Depth	512 K
RAM Size Width	8 bit
Speed	4000 MIPS
Voltage - Supply (Vcc/Vdd) Maximum	3.6 V
Voltage - Supply (Vcc/Vdd) Minimum	0.95 V

XLF224 Series

Part	Number of I/O	Mounting Type	Program Memory Type	Package / Case	Program Memory Width	Program Memory Size	Program Memory Depth	Oscillator Type	Operating Temperature (Min)	Operating Temperature (Max)	Speed	RAM Size Width	RAM Size Depth	Package Width	Package Name	Package Length	Voltage - Supply (Vcc/Vdd) Minimum	Voltage - Supply (Vcc/Vdd) Maximum	Core Count	Core Size (Bit Width)	Core Processor
XMOS XLF224-1024-FB374-C40A	256	Surface Mount	FLASH	374-LFBGA	8 bit	2 MB	2 M	External	0 °C	70 °C	2000 MIPS	8 bit	1 M	18 mm	374-FBGA	18 mm	0.95 V	3.6 V	24 Core	32 Bit	XCore
XMOS XLF224-512-FB374-I40	176	Surface Mount	FLASH	374-LFBGA	8 bit	2 MB	2 M	External	-40 °C	85 °C	4000 MIPS	8 bit	512 K	18 mm	374-FBGA	18 mm	0.95 V	3.6 V	24 Core	32 Bit	XCore

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