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BD9E200FP4-ZTL

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Rohm Semiconductor

4.5V TO 26V INPUT, 2.0A INTEGRATED MOSFET SINGLE SYNCHRONOUS BUCK DC/DC CONVERTER

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Product thumbnail image

BD9E200FP4-ZTL

Active
Rohm Semiconductor

4.5V TO 26V INPUT, 2.0A INTEGRATED MOSFET SINGLE SYNCHRONOUS BUCK DC/DC CONVERTER

Find alt

Description

General part information

BD9E200FP4-Z Series

BD9E200FP4-Z is a single synchronous buck DC/DC converter with built-in low on-resistance power MOSFETs. The Light Load Mode control provides excellent efficiency characteristics in light-load conditions, which make the product ideal for equipment, and devices that demand minimal standby power consumption.

Technical Specifications

Parameters and characteristics for this part

SpecificationBD9E200FP4-ZTL
Current - Output2 A
Frequency - Switching500 kHz
FunctionStep-Down
Mounting TypeSurface Mount
Number of Outputs1
Operating Temperature (Max)85 °C
Operating Temperature (Min)-40 °C
Output ConfigurationPositive
Output TypeAdjustable
Package / CaseTSOT-23-6, SOT-23-6 Thin
Package NameTSOT-23-6L
Synchronous RectifierYes
TopologyBuck
Voltage - Input (Max)26 V
Voltage - Input (Min)4.5 V
Voltage - Output (Max)20.8 V
Voltage - Output (Min/Fixed)0.7 V

Pricing

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CAD

3D models and CAD resources for this part

Documents

Technical documentation and resources

Datasheet
Impedance Characteristics of Bypass Capacitor
Snubber Circuit for Buck Converter IC
Cutting-Edge Web Simulation Tool "ROHM Solution Simulator" Capable of Complete Circuit Verification of Power Devices and Driver ICs
Considerations for Power Inductors Used for Buck Converters
Design Guide and Example of Stencil for Exposed Pad
Capacitor Calculation for Buck converter IC
Calculation of Power Dissipation in Switching Circuit
Basics of Thermal Resistance and Heat Dissipation
PCB Layout Essential Check sheet for Switching Regulator
Factory Information
Method for Determining Constants of Peripheral Parts of Buck DC/DC Converter
BD9E200FP4-Z SPICE Modeling Report
Heat Dissipation Effect of Thermal Via in Exposed Pad Type Package
Simulation Guide for BD9E200FP4-Z / Load Response (ROHM Solution Simulator)
Thermal Resistance
Simulation Guide for BD9E200FP4-Z / Frequency Response (ROHM Solution Simulator)
Three Steps for Successful Design of DC-DC Converters
Measurement Method for Phase Margin with Frequency Response Analyzer (FRA)
PCB Layout Thermal Design Guide
Efficiency of Buck Converter
Judgment Criteria of Thermal Evaluation
How to Use the Thermal Resistance and Thermal Characteristics Parameters
Solder Joint Rate and Thermal Resistance of Exposed Pad
Calculation of Power Loss (Synchronous)
Inductor Calculation for Buck converter IC
Precautions When Measuring the Rear of the Package with a Thermocouple
Five Steps for Successful Thermal Design of IC
Bootstrap Circuit in the Buck Converter
θ<sub>JC</sub> and Ψ<sub>JT</sub>
Precautions for PCB Layout Regarding Common Mode Filters
Power Supply Sequence Circuit with General Purpose Power Supply IC
Two-Resistor Model for Thermal Simulation
Method for Calculating Junction Temperature from Transient Thermal Resistance Data
Suppression Method of Switching Noise Using Linear Regulator and Low Pass Filter
BD9E200FP4-EVK-001 Evaluation Board User's Guide
Types of Capacitors Used for Output Smoothing of Switching Regulators and their Precautions
Resistor Value Table to set Output Voltage of Buck Converter IC
θ<sub>JA</sub> and Ψ<sub>JT</sub>
Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)
Considering Polarity of Power Inductor to Reduce Radiated Emission of DC-DC converter
Diode Selection Method for Asynchronous Converter
How to Use the Two-Resistor Model
Phase Compensation Design for Current Mode Buck Converter
The Important Points of Multi-layer Ceramic Capacitor Used in Buck Converter circuit
TSOT23-6L Package Information
Step-down DC-DC converter PCB layout EMC Design guide
PCB Layout Techniques of Buck Converter
Considering Input Filter to Reduce Conducted Emissions by DCDC Converter
What Is Thermal Design