2SB1709TL
ActiveRohm Semiconductor
PNP, SOT-346T, -12V -1.5A, LOW VCE(SAT) TRANSISTOR
2SB1709TL
ActiveRohm Semiconductor
PNP, SOT-346T, -12V -1.5A, LOW VCE(SAT) TRANSISTOR
Description
General part information
2SB1709 Series
Various products are available in lineup developed focusing on energy-saving and high reliability as main concepts, covering from ultra-compact packages to power-packages to meet the needs in market.
Technical Specifications
Parameters and characteristics for this part
| Specification | 2SB1709TL |
|---|---|
| Current - Collector (Ic) (Max) | 1.5 A |
| Current - Collector Cutoff (Max) | 100 nA |
| DC Current Gain (hFE) (Min) | 270 |
| Frequency - Transition | 400 MHz |
| Mounting Type | Surface Mount |
| Operating Temperature | 150 °C |
| Package / Case | SC-96 |
| Package Name | TSMT3 |
| Power - Max | 0.5 W |
| Transistor Type | PNP |
| Vce Saturation (Max) | 200 mV |
| Voltage - Collector Emitter Breakdown (Max) | 12 V |
Pricing
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CAD
3D models and CAD resources for this part
Documents
Technical documentation and resources
Condition of Soldering / Land Pattern Reference
How to Create Symbols for PSpice Models
Impedance Characteristics of Bypass Capacitor
Basics of Thermal Resistance and Heat Dissipation
Notes for Temperature Measurement Using Forward Voltage of PN Junction
About Flammability of Materials
Temperature derating method for Safe Operating Area (SOA)
Package Dimensions
Part Explanation
Notes for Calculating Power Consumption:Static Operation
Two-Resistor Model for Thermal Simulation
What Is Thermal Design
Types and Features of Transistors
PCB Layout Thermal Design Guide
Explanation for Marking
2SB1709 ESD Data
Measurement Method and Usage of Thermal Resistance RthJC
What is a Thermal Model? (Transistor)
Method for Calculating Junction Temperature from Transient Thermal Resistance Data
Taping Information
Moisture Sensitivity Level - Transistors
Certificate of not containing SVHC under REACH Regulation
How to Use LTspice® Models: Tips for Improving Convergence
Reliability Test Result
Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)
Compliance of the RoHS directive
Method for Monitoring Switching Waveform
2SB1709 Thermal Resistance
Precautions When Measuring the Rear of the Package with a Thermocouple
How to Use LTspice® Models
Anti-Whisker formation - Transistors
Notes for Temperature Measurement Using Thermocouples
Calculation of Power Dissipation in Switching Circuit
Importance of Probe Calibration When Measuring Power: Deskew
Inner Structure
About Export Regulations
2SB1709 Data Sheet
List of Transistor Package Thermal Resistance