
BR25H256NUX-5ACTR
ActiveRohm Semiconductor
256KBIT, SPI BUS, HIGH SPEED WRITE CYCLE, HIGH ENDURANCE, SERIAL EEPROM FOR AUTOMOTIVE (125℃ OPERATION)

BR25H256NUX-5ACTR
ActiveRohm Semiconductor
256KBIT, SPI BUS, HIGH SPEED WRITE CYCLE, HIGH ENDURANCE, SERIAL EEPROM FOR AUTOMOTIVE (125℃ OPERATION)
Description
General part information
BR25H256 Series
BR25H256xxx-5AC Series is a 256Kbit serial EEPROM of SPI BUS Interface.
Technical Specifications
Parameters and characteristics for this part
| Specification | BR25H256NUX-5ACTR |
|---|---|
| Clock Frequency | 20 MHz |
| Grade | Automotive |
| Memory Depth | 32 K |
| Memory Format | EEPROM |
| Memory Interface (Type) | SPI |
| Memory Size | 32 kB |
| Memory Type | Non-Volatile |
| Memory Width | 8 bit |
| Mounting Type | Surface Mount |
| Operating Temperature (Max) | 125 °C |
| Operating Temperature (Min) | -40 °C |
| Package / Case | 8-UFDFN Exposed Pad |
| Package Name | VSON008X2030 |
| Qualification | AEC-Q100 |
| Technology | EEPROM |
| Voltage - Supply (Maximum) | 5.5 V |
| Voltage - Supply (Minimum) | 1.7 V |
| Write Cycle Time - Page | 3.5 ms |
| Write Cycle Time - Word | 3.5 ms |
Pricing
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CAD
3D models and CAD resources for this part
Documents
Technical documentation and resources
What Is Thermal Design
Thermal Resistance
Impedance Characteristics of Bypass Capacitor
VSON008X2030 Package Information
Heat Dissipation Effect of Thermal Via in Exposed Pad Type Package
Method for Calculating Junction Temperature from Transient Thermal Resistance Data
BR25H256NUX-5AC Data Sheet
Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)
Factory Information
Opcode, Address, and Page Configuration for SPI BUS EEPROM
Five Steps for Successful Thermal Design of IC
Solder Joint Rate and Thermal Resistance of Exposed Pad
Basics of Thermal Resistance and Heat Dissipation
Design Guide and Example of Stencil for Exposed Pad