40-3503-30

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Aries Electronics

CONN IC DIP SOCKET 40POS GOLD

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40-3503-30

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Aries Electronics

CONN IC DIP SOCKET 40POS GOLD

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Specifications Pricing Series Description Documents

Technical Specifications

Parameters and characteristics for this part

Specification	40-3503-30

Contact Finish - Mating	Gold
Contact Finish - Post	Tin
Contact Finish Thickness - Mating	10 çin
Contact Finish Thickness - Mating	0.25 çm
Contact Finish Thickness - Post	200 µin
Contact Finish Thickness - Post	5.08 µm
Contact Material - Mating	Beryllium Copper
Contact Material - Post	Phosphor Bronze
Current Rating (Amps)	3 A
Features	Closed Frame
Housing Material	Glass Filled, Polyamide (PA46), Nylon 4/6
Material Flammability Rating	UL94 V-0
Mounting Type	Through Hole
Number of Positions or Pins (Grid)	40
Number of Positions or Pins (Grid) [custom]	20
Number of Positions or Pins (Grid) [custom]	2
Operating Temperature [Max]	105 ░C
Operating Temperature [Min]	-55 °C
Pitch - Mating	0.1 in
Pitch - Mating	2.54 mm
Pitch - Post	2.54 mm
Pitch - Post	0.1 in
Termination	Wire Wrap
Termination Post Length	0.5 in
Termination Post Length	12.7 mm
Type	0.3 "
Type	7.62 mm
Type	DIP

40-3503 Series

Part	Material Flammability Rating	Pitch - Post	Pitch - Post	Current Rating (Amps)	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Mounting Type	Type	Type	Type	Pitch - Mating	Pitch - Mating	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Termination Post Length [x]	Termination Post Length [x]	Contact Material - Post	Contact Finish - Post	Features	Contact Material - Mating	Operating Temperature [Min]	Operating Temperature [Max]	Contact Finish - Mating	Housing Material	Number of Positions or Pins (Grid)	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]	Termination	Termination Post Length	Termination Post Length
Aries Electronics 40-3503-21	UL94 V-0	2.54 mm	0.1 in	3 A	10 çin	0.25 çm	Through Hole	0.3 "	7.62 mm	DIP	0.1 in	2.54 mm	10 çin	0.25 çm	0.36 in	9.14 mm	Phosphor Bronze	Gold	Closed Frame	Beryllium Copper	-55 °C	125 °C	Gold	Glass Filled Nylon 4/6 Polyamide (PA46)	40	20	2	Wire Wrap
Aries Electronics 40-3503-20	UL94 V-0	2.54 mm	0.1 in	3 A	200 µin	5.08 µm	Through Hole	0.3 "	7.62 mm	DIP	0.1 in	2.54 mm	10 çin	0.25 çm	0.36 in	9.14 mm	Phosphor Bronze	Tin	Closed Frame	Beryllium Copper	-55 °C	105 ░C	Gold	Glass Filled Nylon 4/6 Polyamide (PA46)	40	20	2	Wire Wrap
Aries Electronics 40-3503-30	UL94 V-0	2.54 mm	0.1 in	3 A	200 µin	5.08 µm	Through Hole	0.3 "	7.62 mm	DIP	0.1 in	2.54 mm	10 çin	0.25 çm			Phosphor Bronze	Tin	Closed Frame	Beryllium Copper	-55 °C	105 ░C	Gold	Glass Filled Nylon 4/6 Polyamide (PA46)	40	20	2	Wire Wrap	0.5 in	12.7 mm
Aries Electronics 40-3503-31	UL94 V-0	2.54 mm	0.1 in	3 A	10 çin	0.25 çm	Through Hole	0.3 "	7.62 mm	DIP	0.1 in	2.54 mm	10 çin	0.25 çm			Phosphor Bronze	Gold	Closed Frame	Beryllium Copper	-55 °C	125 °C	Gold	Glass Filled Nylon 4/6 Polyamide (PA46)	40	20	2	Wire Wrap	0.5 in	12.7 mm

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Bulk	28	$ 15.75

Description

General part information

40-3503 Series

40 (2 x 20) Pos DIP, 0.3" (7.62mm) Row Spacing Socket Gold Through Hole

Documents

Technical documentation and resources