M2S010S-1FGG484I

Obsolete

Microsemi Corporation

IC SOC CORTEX-M3 166MHZ 484FBGA

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Obsolete

Microsemi Corporation

IC SOC CORTEX-M3 166MHZ 484FBGA

Technical Specifications

Parameters and characteristics for this part

Specification	M2S010S-1FGG484I

Architecture	MCU, FPGA
Connectivity	CANbus, USB, Ethernet, SPI, UART/USART, I2C
Core Processor	ARM® Cortex®-M3
Flash Size	256 KB
Number of I/O	233
Operating Temperature [Max]	100 °C
Operating Temperature [Min]	-40 C
Package / Case	484-BGA
Peripherals	DDR, PCIe, SERDES
Primary Attributes	FPGA - 10K Logic Modules
RAM Size	64 KB
Speed	166 MHz
Supplier Device Package	484-FPBGA (23x23)

Part	Operating Temperature [Max]	Operating Temperature [Min]	Speed	RAM Size	Supplier Device Package	Package / Case	Number of I/O	Primary Attributes	Connectivity	Flash Size	Architecture	Peripherals	Core Processor
Microsemi Corporation M2S010S-1FG484I	100 °C	-40 C	166 MHz	64 KB	484-FPBGA (23x23)	484-BGA	233	FPGA - 10K Logic Modules	CANbus Ethernet I2C SPI UART/USART USB	256 KB	MCU FPGA	DDR PCIe SERDES	ARM® Cortex®-M3
Microsemi Corporation M2S010S-1FGG484I	100 °C	-40 C	166 MHz	64 KB	484-FPBGA (23x23)	484-BGA	233	FPGA - 10K Logic Modules	CANbus Ethernet I2C SPI UART/USART USB	256 KB	MCU FPGA	DDR PCIe SERDES	ARM® Cortex®-M3

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

General part information

ARM® Cortex®-M3 System On Chip (SOC) IC SmartFusion®2 FPGA - 10K Logic Modules 166MHz 484-FPBGA (23x23)

Technical documentation and resources