Specification	91-7068-8844

Ag Composition	3 %
Composition Elements	Cu, Sn, Ag
Composition Formula	Sn96.5Ag3Cu0.5
Cu Composition	0.5 %
Diameter	0.015 in
Form	Spool
Form Weight	8.8 oz
Melting Point (Max)	424 °F
Melting Point (Min)	423 °F
Process	Lead Free
Sn Composition	96.5 %
Storage/Refrigeration Temperature (Maximum)	104 °F
Storage/Refrigeration Temperature (Minimum)	50 °F
Type	Wire Solder
Wire Gauge	28 SWG, 27 AWG

91-7068 Series

Part	Process	Type	Diameter	Ag Composition	Composition Elements	Composition Formula	Cu Composition	Sn Composition	Form Weight	Form	Storage/Refrigeration Temperature (Minimum)	Storage/Refrigeration Temperature (Maximum)	Melting Point (Max)	Melting Point (Min)	Wire Gauge
Kester Solder 91-7068-7608	Lead Free	Wire Solder	0.015 in	3 %	Ag Cu Sn	Sn96.5Ag3Cu0.5	0.5 %	96.5 %	8.8 oz	Spool	50 °F	104 °F	424 °F	423 °F	27 AWG 28 SWG
Kester Solder 91-7068-7615	Lead Free	Wire Solder	0.015 in	3 %	Ag Cu Sn	Sn96.5Ag3Cu0.5	0.5 %	96.5 %	8.8 oz	Spool	50 °F	104 °F	424 °F	423 °F	27 AWG 28 SWG
Kester Solder 91-7068-8853	Lead Free	Wire Solder	0.015 in	3 %	Ag Cu Sn	Sn96.5Ag3Cu0.5	0.5 %	96.5 %	8.8 oz	Spool	50 °F	104 °F	424 °F	423 °F	27 AWG 28 SWG
Kester Solder 91-7068-8844	Lead Free	Wire Solder	0.015 in	3 %	Ag Cu Sn	Sn96.5Ag3Cu0.5	0.5 %	96.5 %	8.8 oz	Spool	50 °F	104 °F	424 °F	423 °F	27 AWG 28 SWG
Kester Solder 91-7068-7623	Lead Free	Wire Solder	0.01 in	3 %	Ag Cu Sn	Sn96.5Ag3Cu0.5	0.5 %	96.5 %	8.8 oz	Spool	50 °F	104 °F	424 °F	423 °F	30 AWG 33 SWG
Kester Solder 91-7068-7603	Lead Free	Wire Solder	0.02 in	3 %	Ag Cu Sn	Sn96.5Ag3Cu0.5	0.5 %	96.5 %	8.8 oz	Spool	50 °F	104 °F	424 °F	423 °F	24 AWG 25 SWG
Kester Solder 91-7068-8843	Lead Free	Wire Solder	0.015 in	3 %	Ag Cu Sn	Sn96.5Ag3Cu0.5	0.5 %	96.5 %	8.8 oz	Spool	50 °F	104 °F	424 °F	423 °F	27 AWG 28 SWG

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