TLW-111-06-T-D

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Samtec Inc.

CONN UNSHROUDED HEADER HDR 22 POS 2.54MM SOLDER ST TOP ENTRY THRU-HOLE BULK

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TLW-111-06-T-D

Active

Samtec Inc.

CONN UNSHROUDED HEADER HDR 22 POS 2.54MM SOLDER ST TOP ENTRY THRU-HOLE BULK

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Specifications Pricing Series Description Documents

Technical Specifications

Parameters and characteristics for this part

Specification	TLW-111-06-T-D

Connector Type	Header
Contact Finish - Post	Tin
Contact Length - Post [x]	0.135 in
Contact Length - Post [x]	3.43 mm
Contact Material	Phosphor Bronze
Contact Shape	Square
Contact Type	Male Pin
Current Rating (Amps)	5.2 A
Fastening Type	Push-Pull
Insulation Color	Black
Insulation Height [z]	0.06 in
Insulation Height [z]	1.52 mm
Insulation Material	Liquid Crystal Polymer (LCP)
Mounting Type	Through Hole
Number of Positions	22 positions
Number of Positions Loaded	All
Number of Rows	2
Operating Temperature [Max]	105 ░C
Operating Temperature [Min]	-55 °C
Overall Contact Length	7.62 mm
Overall Contact Length	0.3 in
Pitch - Mating	0.1 in
Pitch - Mating	2.54 mm
Row Spacing - Mating [x]	2.54 mm
Row Spacing - Mating [x]	0.1 in
Shrouding	Unshrouded
Style	Board to Board, Cable
Termination	Solder

TLW-111 Series

Part	Number of Positions	Contact Length - Post [x]	Contact Length - Post [x]	Style	Mounting Type	Insulation Height [z]	Insulation Height [z]	Contact Type	Overall Contact Length	Overall Contact Length	Number of Positions Loaded	Row Spacing - Mating [x]	Row Spacing - Mating [x]	Current Rating (Amps)	Operating Temperature [Min]	Operating Temperature [Max]	Pitch - Mating	Pitch - Mating	Number of Rows	Fastening Type	Shrouding	Termination	Contact Shape	Insulation Color	Contact Material	Insulation Material	Contact Finish - Mating	Connector Type	Contact Finish - Post	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Finish Thickness - Post
Samtec Inc. TLW-111-06-S-D	22 positions	0.135 in	3.43 mm	Board to Board Cable	Through Hole	0.06 in	1.52 mm	Male Pin	7.62 mm	0.3 in	All	2.54 mm	0.1 in	5.2 A	-55 °C	125 °C	0.1 in	2.54 mm	2	Push-Pull	Unshrouded	Solder	Square	Black	Phosphor Bronze	Liquid Crystal Polymer (LCP)	Gold	Header
Samtec Inc. TLW-111-06-T-D	22 positions	0.135 in	3.43 mm	Board to Board Cable	Through Hole	0.06 in	1.52 mm	Male Pin	7.62 mm	0.3 in	All	2.54 mm	0.1 in	5.2 A	-55 °C	105 ░C	0.1 in	2.54 mm	2	Push-Pull	Unshrouded	Solder	Square	Black	Phosphor Bronze	Liquid Crystal Polymer (LCP)		Header	Tin
Samtec Inc. TLW-111-06-G-S	11	0.135 in	3.43 mm	Board to Board Cable	Through Hole	0.06 in	1.52 mm	Male Pin	7.62 mm	0.3 in	All			5.2 A	-55 °C	125 °C	0.1 in	2.54 mm	1	Push-Pull	Unshrouded	Solder	Square	Black	Phosphor Bronze	Liquid Crystal Polymer (LCP)	Gold	Header	Gold	10 çin	0.25 çm	Flash
Samtec Inc. TLW-111-06-T-S	11	0.135 in	3.43 mm	Board to Board Cable	Through Hole	0.06 in	1.52 mm	Male Pin	7.62 mm	0.3 in	All			5.2 A	-55 °C	105 ░C	0.1 in	2.54 mm	1	Push-Pull	Unshrouded	Solder	Square	Black	Phosphor Bronze	Liquid Crystal Polymer (LCP)		Header	Tin

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Bulk	1	$ 2.87
		10	$ 2.60
		100	$ 2.29
		500	$ 1.95
		1000	$ 1.66
		5000	$ 1.51

Description

General part information

TLW-111 Series

Connector Header Through Hole 22 position 0.100" (2.54mm)

Documents

Technical documentation and resources

TLW Datasheet

Datasheet