Specification	10085429-11213TLF

Card Thickness	0.062 in
Card Type	PCI Express™
Color	Black
Contact Finish	Gold
Contact Finish Thickness	15 µin
Contact Material	Copper Alloy
Features	Card Latch, Locking Ramp, Board Guide
Gender	Female
Material - Insulation	Glass Filled, Thermoplastic
Mounting Type	Through Hole
Number of Positions	164
Number of Rows	2
Operating Temperature (Max)	85 °C
Operating Temperature (Min)	-55 °C
Pitch	0.039 in
Read Out	Dual
Termination	Solder

10085429 Series

Part	Material - Insulation	Operating Temperature (Min)	Operating Temperature (Max)	Card Type	Contact Material	Termination	Mounting Type	Features	Card Thickness	Pitch	Number of Positions	Color	Gender	Contact Finish Thickness	Contact Finish	Number of Rows	Read Out
Amphenol ICC (FCI) 10085429-11123TLF	Glass Filled Thermoplastic	-55 °C	85 °C	PCI Express™	Copper Alloy	Solder	Through Hole	Board Guide Card Latch Locking Ramp	0.062 in	0.039 in	164	Black	Female	15 µin	Gold	2	Dual
Amphenol ICC (FCI) 10085429-11213TLF	Glass Filled Thermoplastic	-55 °C	85 °C	PCI Express™	Copper Alloy	Solder	Through Hole	Board Guide Card Latch Locking Ramp	0.062 in	0.039 in	164	Black	Female	15 µin	Gold	2	Dual
Amphenol ICC (FCI) 10085429-11023TLF	Glass Filled Thermoplastic	-55 °C	85 °C	PCI Express™	Copper Alloy	Solder	Through Hole	Board Guide Card Latch Locking Ramp	0.062 in	0.039 in	164	Black	Female	15 µin	Gold	2	Dual
Amphenol ICC (FCI) 10085429-41223TLF	Glass Filled Thermoplastic	-55 °C	85 °C	PCI Express™	Copper Alloy	Solder	Through Hole	Board Guide Card Latch Locking Ramp	0.062 in	0.039 in	164	Blue	Female	15 µin	Gold	2	Dual
Amphenol ICC (FCI) 10085429-11113TLF	Glass Filled Thermoplastic	-55 °C	85 °C	PCI Express™	Copper Alloy	Solder	Through Hole	Board Guide Card Latch Locking Ramp	0.062 in	0.039 in	164	Black	Female	15 µin	Gold	2	Dual

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