
RF505BGE6STL
ActiveRohm Semiconductor
RECTIFIER, 600V, 5A, TO-252 ROHS COMPLIANT: YES

RF505BGE6STL
ActiveRohm Semiconductor
RECTIFIER, 600V, 5A, TO-252 ROHS COMPLIANT: YES
Description
General part information
RF505 Series
ROHM's fast recovery diodes are ultra high-speed, low VF, and suited for significant efficiency increase of switching power supply as well as reduction of switching loss.
Technical Specifications
Parameters and characteristics for this part
| Specification | RF505BGE6STL |
|---|---|
| Current - Average Rectified (Io) | 5 A |
| Current - Reverse Leakage | 10 µA |
| Mounting Type | Surface Mount |
| Operating Temperature - Junction | 150 °C |
| Package / Case | SC-63, DPAK (2 Leads + Tab), TO-252-3 |
| Package Name | TO-252GE |
| Reverse Recovery Time (trr) | 30 ns |
| Speed - Fast Recovery (Maximum) | 500 ns |
| Speed - Fast Recovery (Minimum) | 200 mA |
| Technology | Standard |
| Voltage - DC Reverse (Vr) (Max) | 600 V |
| Voltage - Forward (Vf) (Max) | 1.7 V |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
Sign in to see pricing
Create a free account to access distributor pricing data.
CAD
3D models and CAD resources for this part
Documents
Technical documentation and resources
Datasheet
Notes for Temperature Measurement Using Forward Voltage of PN Junction
Notes for Calculating Power Consumption:Static Operation
Judgment Criteria of Thermal Evaluation
PCB Layout Thermal Design Guide
Diode Types and Applications
Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)
RF505BGE6S ESD Data
Importance of Probe Calibration When Measuring Power: Deskew
List of Diode Package Thermal Resistance
How to Select Reverse Current Protection Diodes for LDO Regulators
Method for Calculating Junction Temperature from Transient Thermal Resistance Data
Notes for Temperature Measurement Using Thermocouples
θ<sub>JC</sub> and Ψ<sub>JT</sub>
About Export Regulations
Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials
θ<sub>JA</sub> and Ψ<sub>JT</sub>
What Is Thermal Design
About Flammability of Materials
Reliability Test Result
Precautions When Measuring the Rear of the Package with a Thermocouple
Method for Monitoring Switching Waveform
How to Use LTspice® Models
Anti-Whisker formation - Diodes
Absolute Maximum Rating and Electrical Characteristics of Diodes
Compliance of the RoHS directive
Moisture Sensitivity Level - Diodes
How to Select Rectifier Diodes
What is a Thermal Model? (Diode)
Basics of Thermal Resistance and Heat Dissipation
Report of SVHC under REACH Regulation
Power Loss and Thermal Design of Diodes
Two-Resistor Model for Thermal Simulation
Part Explanation
Impedance Characteristics of Bypass Capacitor
How to Use LTspice® Models: Tips for Improving Convergence
How to Create Symbols for PSpice Models
How to Use the Thermal Resistance and Thermal Characteristics Parameters
Measurement Method and Usage of Thermal Resistance RthJC