Specification	TSM-140-01-F-DV

Connector Type	Header, Cuttable
Contact Finish - Mating	Gold
Contact Finish - Post	Tin
Contact Finish Thickness - Mating	3 µin
Contact Length - Mating	0.23 in
Contact Material	Phosphor Bronze
Contact Shape	Square
Contact Type	Male Pin
Fastening Type	Push-Pull
Insulation Color	Black
Insulation Height	0.1 in
Insulation Material	Liquid Crystal Polymer (LCP)
Material Flammability Rating	UL94 V-0
Mounting Type	Surface Mount
Number of Positions	80
Number of Positions Loaded	All
Number of Rows	2
Operating Temperature (Max)	125 °C
Operating Temperature (Min)	-55 °C
Pitch - Mating	0.1 in
Row Spacing - Mating	0.1 in
Shrouding	Unshrouded
Style	Board, Board or Cable
Termination	Solder

TSM Series

...

Part	Shrouding	Contact Finish Thickness - Mating	Contact Finish - Mating	Features	Insulation Color	Mounting Type	Contact Material	Pitch - Mating	Material Flammability Rating	Number of Rows	Fastening Type	Contact Length - Mating	Number of Positions Loaded	Termination	Connector Type	Style	Contact Type	Contact Shape	Number of Positions	Contact Finish - Post	Row Spacing - Mating	Insulation Height	Operating Temperature (Max)	Operating Temperature (Min)	Insulation Material	Number of Positions Loaded
Samtec Inc. TSM-119-02-L-DV-A	Unshrouded	10 µin	Gold	Board Guide	Black	Surface Mount	Phosphor Bronze	0.1 in	UL94 V-0	2	Push-Pull	0.32 in	All	Solder	Cuttable Header	Board Board or Cable	Male Pin	Square	38	Tin	0.1 in	0.1 in	125 °C	-55 °C	Liquid Crystal Polymer (LCP)
Samtec Inc. TSM-116-03-T-SV	Unshrouded		Tin		Black	Surface Mount	Phosphor Bronze	0.1 in	UL94 V-0	1	Push-Pull	0.42 in	All	Solder	Cuttable Header	Board Board or Cable	Male Pin	Square	16	Tin		0.1 in	105 °C	-55 °C	Liquid Crystal Polymer (LCP)
Samtec Inc. TSM-106-02-L-SH-LC-005	Unshrouded	10 µin	Gold	Board Lock	Black	Right Angle Surface Mount	Phosphor Bronze	0.1 in	UL94 V-0	1	Push-Pull	0.32 in		Solder	Header	Board Board or Cable	Male Pin	Square	6	Tin		0.12 in	125 °C	-55 °C	Liquid Crystal Polymer (LCP)	5
Samtec Inc. TSM-127-02-L-DV-A	Unshrouded	10 µin	Gold	Board Guide	Black	Surface Mount	Phosphor Bronze	0.1 in	UL94 V-0	2	Push-Pull	0.32 in	All	Solder	Cuttable Header	Board Board or Cable	Male Pin	Square	54	Tin	0.1 in	0.1 in	125 °C	-55 °C	Liquid Crystal Polymer (LCP)
Samtec Inc. TSM-114-03-S-SV-TR	Unshrouded	30 µin	Gold		Black	Surface Mount	Phosphor Bronze	0.1 in	UL94 V-0	1	Push-Pull	0.42 in	All	Solder	Cuttable Header	Board Board or Cable	Male Pin	Square	14	Tin		0.1 in	125 °C	-55 °C	Liquid Crystal Polymer (LCP)
Samtec Inc. TSM-118-01-S-SV
Samtec Inc. TSM-108-01-T-DV-A-P	Unshrouded		Tin	Board Guide Pick and Place	Black	Surface Mount	Phosphor Bronze	0.1 in	UL94 V-0	2	Push-Pull	0.23 in	All	Solder	Cuttable Header	Board Board or Cable	Male Pin	Square	16	Tin	0.1 in	0.1 in	105 °C	-55 °C	Liquid Crystal Polymer (LCP)
Samtec Inc. TSM-129-01-T-DV	Unshrouded		Tin		Black	Surface Mount	Phosphor Bronze	0.1 in	UL94 V-0	2	Push-Pull	0.23 in	All	Solder	Cuttable Header	Board Board or Cable	Male Pin	Square	58	Tin	0.1 in	0.1 in	105 °C	-55 °C	Liquid Crystal Polymer (LCP)
Samtec Inc. TSM-121-01-S-DV-P-TR	Unshrouded	30 µin	Gold	Pick and Place	Black	Surface Mount	Phosphor Bronze	0.1 in	UL94 V-0	2	Push-Pull	0.23 in	All	Solder	Cuttable Header	Board Board or Cable	Male Pin	Square	42	Tin	0.1 in	0.1 in	125 °C	-55 °C	Liquid Crystal Polymer (LCP)
Samtec Inc. TSM-105-02-S-SH	Unshrouded	30 µin	Gold		Black	Right Angle Surface Mount	Phosphor Bronze	0.1 in	UL94 V-0	1	Push-Pull	0.32 in	All	Solder	Header	Board Board or Cable	Male Pin	Square	5	Tin		0.12 in	125 °C	-55 °C	Liquid Crystal Polymer (LCP)

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TSM-140-01-F-DV | Datasheet