
STM32F732IEK6
ActiveHIGH-PERFORMANCE AND DSP WITH FPU, ARM CORTEX-M7 MCU WITH 512 KBYTES OF FLASH MEMORY, 216 MHZ CPU, ART ACCELERATOR, L1 CACHE, SDRAM
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STM32F732IEK6
ActiveHIGH-PERFORMANCE AND DSP WITH FPU, ARM CORTEX-M7 MCU WITH 512 KBYTES OF FLASH MEMORY, 216 MHZ CPU, ART ACCELERATOR, L1 CACHE, SDRAM
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Technical Specifications
Parameters and characteristics for this part
| Specification | STM32F732IEK6 |
|---|---|
| Connectivity | IrDA, QSPI, EBI/EMI, CANbus, I2C, USB, LINbus, SAI, UART/USART, SPI, MMC/SD |
| Core Processor | ARM® Cortex®-M7 |
| Core Size | 32-Bit Single-Core |
| Data Converters | A/D 24x12b, D/A 2x12b |
| Mounting Type | Surface Mount |
| Number of I/O | 140 |
| Operating Temperature [Max] | 85 °C |
| Operating Temperature [Min] | -40 °C |
| Oscillator Type | Internal |
| Package / Case | 201-UFBGA |
| Peripherals | Brown-out Detect/Reset, DMA, POR, WDT, PWM, I2S |
| Program Memory Size | 512 KB |
| Program Memory Type | FLASH |
| RAM Size | 256 K |
| Speed | 216 MHz |
| Supplier Device Package | 176+25UFBGA (10x10) |
| Voltage - Supply (Vcc/Vdd) [Max] | 3.6 V |
| Voltage - Supply (Vcc/Vdd) [Min] | 1.7 V |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | Tray | 1 | $ 17.66 | |
| 10 | $ 12.73 | |||
| 25 | $ 11.46 | |||
| 80 | $ 10.24 | |||
| 230 | $ 9.42 | |||
| 440 | $ 9.02 | |||
| 945 | $ 8.94 | |||
Description
General part information
STM32F732IE Series
The STM32F732xx and STM32F733xx devices are based on the high-performance Arm®Cortex®-M7 32-bit RISC core operating at up to 216 MHz frequency. The Cortex®-M7 core features a single floating point unit (SFPU) precision which supports Arm®single-precision data-processing instructions and data types. It also implements a full set of DSP instructions and a memory protection unit (MPU) which enhances the application security.
The STM32F732xx and STM32F733xx devices incorporate high-speed embedded memories with a Flash memory up to 512 Kbytes, 256 Kbytes of SRAM (including 64 Kbytes of data TCM RAM for critical real-time data), 16 Kbytes of instruction TCM RAM (for critical real-time routines), 4 Kbytes of backup SRAM available in the lowest power modes, and an extensive range of enhanced I/Os and peripherals connected to two APB buses, two AHB buses, a 32-bit multi-AHB bus matrix and a multi layer AXI interconnect supporting internal and external memories access.
All the devices offer three 12-bit ADCs, two DACs, a low-power RTC, thirteen general-purpose 16-bit timers including two PWM timers for motor control, two general-purpose 32-bit timers, a true random number generator (RNG). They also feature standard and advanced communication interfaces.
Documents
Technical documentation and resources