Technical Specifications
Parameters and characteristics for this part
| Specification | HSEC1-030-01-S-DV-WT-K-TR |
|---|---|
| Card Thickness | 0.062 in |
| Card Thickness | 1.57 mm |
| Card Type | PCI Express™ |
| Color | Black |
| Contact Finish | Gold |
| Contact Finish Thickness | 0.76 Ám |
| Contact Finish Thickness | 30 Áin |
| Contact Material | Phosphor Bronze |
| Contact Type | Cantilever |
| Features | Pick and Place, Solder Retention |
| Gender | Female |
| Material - Insulation | Liquid Crystal Polymer (LCP) |
| Mounting Type | Surface Mount |
| Number of Positions | 60 |
| Number of Positions/Bay/Row [custom] | 30 |
| Number of Rows | 2 |
| Operating Temperature [Max] | 125 °C |
| Operating Temperature [Min] | -55 °C |
| Pitch [x] | 0.039 in |
| Pitch [x] | 1 mm |
| Read Out | Dual |
| Termination | Solder |
| Termination Rows | 2 |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
Description
General part information
HSEC1 Series
Standard Card Edge Connectors 1.00 mm Edge Rate High-Speed Edge Card Connector, Vertical
Documents
Technical documentation and resources
