SEAMP-10-02.0-S-04
ActiveSamtec Inc.
CONN HD ARRAY M 40POS PRESS-FIT
Deep-Dive with AI
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SEAMP-10-02.0-S-04
ActiveSamtec Inc.
CONN HD ARRAY M 40POS PRESS-FIT
Deep-Dive with AI
DocumentsDatasheet
Technical Specifications
Parameters and characteristics for this part
| Specification | SEAMP-10-02.0-S-04 |
|---|---|
| Connector Type | High Density Array, Male |
| Contact Finish | Gold |
| Contact Finish Thickness | 0.76 Ám |
| Contact Finish Thickness | 30 Áin |
| Height Above Board | 0.181 in |
| Height Above Board | 4.6 mm |
| Mated Stacking Heights | 8 mm, 8.5 mm, 7 mm |
| Mounting Type | Through Hole |
| Number of Positions | 40 |
| Pitch [x] | 0.05 in |
| Pitch [x] | 1.27 mm |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | Tray | 84 | $ 7.94 | |
Description
General part information
SEAMP-10 Series
40 Position Connector High Density Array, Male Through Hole Gold
Documents
Technical documentation and resources