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W63CH2MBVACE

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Winbond Electronics

IC DRAM 4GBIT PAR 178VFBGA

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W63CH2MBVACE

Active
Winbond Electronics

IC DRAM 4GBIT PAR 178VFBGA

Deep-Dive with AI

DocumentsDatasheet

Technical Specifications

Parameters and characteristics for this part

SpecificationW63CH2MBVACE
Clock Frequency933 MHz
Memory FormatDRAM
Memory InterfaceParallel
Memory Organization128 M
Memory Size512 kb
Memory TypeVolatile
Mounting TypeSurface Mount
Operating Temperature [Max]85 °C
Operating Temperature [Min]-25 °C
Package / Case178-VFBGA
Supplier Device Package178-VFBGA
Supplier Device Package [x]11
Supplier Device Package [y]11.5
TechnologySDRAM - Mobile LPDDR3
Voltage - Supply [Max]1.95 V, 1.3 V
Voltage - Supply [Min]1.7 V, 1.14 V
Write Cycle Time - Word, Page15 ns

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$

W63CH2 Series

IC DRAM 4GBIT PAR 178VFBGA

PartMemory FormatOperating Temperature [Min]Operating Temperature [Max]Clock FrequencyMemory TypeMounting TypeSupplier Device PackageSupplier Device Package [y]Supplier Device Package [x]TechnologyMemory InterfaceVoltage - Supply [Min]Voltage - Supply [Max]Write Cycle Time - Word, PageMemory OrganizationMemory SizePackage / Case
Winbond Electronics
W63CH2MBVACE
DRAM
-25 °C
85 °C
933 MHz
Volatile
Surface Mount
178-VFBGA
11.5
11
SDRAM - Mobile LPDDR3
Parallel
1.14 V, 1.7 V
1.3 V, 1.95 V
15 ns
128 M
512 kb
178-VFBGA

Description

General part information

W63CH2 Series

SDRAM - Mobile LPDDR3 Memory IC 4Gbit Parallel 933 MHz 178-VFBGA (11x11.5)

Documents

Technical documentation and resources

Datasheet

Datasheet