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TO-247N

RGW00TS65CHRC11

Obsolete
Rohm Semiconductor

HIGH-SPEED FAST SWITCHING TYPE, 650V 50A, AUTOMOTIVE HYBRID IGBT WITH BUILT-IN SIC-SBD

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TO-247N

RGW00TS65CHRC11

Obsolete
Rohm Semiconductor

HIGH-SPEED FAST SWITCHING TYPE, 650V 50A, AUTOMOTIVE HYBRID IGBT WITH BUILT-IN SIC-SBD

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Description

General part information

RGW00 Series

The RGWxx65C series is a 650V IGBT with a built-in SiC schottky barrier diode, which reduces turn-on switching loss. This is an AEC-Q101 compliant product. It can be used with confidence even in harsh environments such as xEV on-board chargers, DC/DC converters, solar power conditioners, and UPS.

Technical Specifications

Parameters and characteristics for this part

SpecificationRGW00TS65CHRC11
Current - Collector (Ic) (Max)96 A
Current - Collector Pulsed (Icm)200 A
Gate Charge141 nC
Input TypeStandard
Mounting TypeThrough Hole
Operating Temperature (Max)175 °C
Operating Temperature (Min)-40 °C
Package / CaseTO-247-3
Package NameTO-247N
Power - Max254 W
Reverse Recovery Time (trr)33 ns
Switching Energy (Off)420 µJ
Switching Energy (On)180 µJ
Td (off) @ 25°C180 ns
Td (on) @ 25°C49 ns
Test Condition Current25 A
Test Condition Resistance10 Ohm
Test Condition Voltage400 V
Test Condition Voltage (Secondary)15 V
Vce(on) (Max)1.9 V
Voltage - Collector Emitter Breakdown (Max)650 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

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CAD

3D models and CAD resources for this part

Documents

Technical documentation and resources

Estimation of switching losses in IGBTs operating with resistive load
How to Use the Thermal Resistance and Thermal Characteristics Parameters
Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)
The Problem with Traditional Vaccine Storage Freezers and How ROHM Cutting-edge Power Solutions Can Take them to the Next Level
Method for Monitoring Switching Waveform
θ<sub>JC</sub> and Ψ<sub>JT</sub>
Types and Features of Transistors
Notes for Calculating Power Consumption:Static Operation
How to Use LTspice&reg; Models
Semikron Danfoss: Partnering for the Safe Supply of Industrial Power Modules
4 Steps for Successful Thermal Designing of Power Devices
Anti-Whisker formation
Part Explanation
Basics of Thermal Resistance and Heat Dissipation
Two-Resistor Model for Thermal Simulation
θ<sub>JA</sub> and Ψ<sub>JT</sub>
Generation Mechanism of Voltage Surge on Commutation Side (Basic)
Importance of Probe Calibration When Measuring Power: Deskew
Precautions for Thermal Resistance of Insulation Sheet
About Flammability of Materials
Notes for Temperature Measurement Using Thermocouples
Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials
Judgment Criteria of Thermal Evaluation
Measurement Method and Usage of Thermal Resistance RthJC
Power Eco Family: Overview of ROHM's Power Semiconductor Lineup
Notes for Temperature Measurement Using Forward Voltage of PN Junction
Precautions When Measuring the Rear of the Package with a Thermocouple
What is a Thermal Model? (IGBT)
Moisture Sensitivity Level
Package Dimensions
Compliance of the ELV directive
About Export Administration Regulations (EAR)
Method for Calculating Junction Temperature from Transient Thermal Resistance Data
What Is Thermal Design
Calculation of Power Dissipation in Switching Circuit
How to Use LTspice&reg; Models: Tips for Improving Convergence
PCB Layout Thermal Design Guide
Impedance Characteristics of Bypass Capacitor