CYW20835PB1KML1GGF

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Infineon Technologies

BLUETOOTH MODULE, BLE 5.2, 2 MBPS, -94.5 DBM, 1.62 TO 3.63 V, -30 °C TO 85 °C, AIROC SERIES

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DocumentsTechnical Data Sheet EN

CYW20835PB1KML1GGF

Active

Infineon Technologies

BLUETOOTH MODULE, BLE 5.2, 2 MBPS, -94.5 DBM, 1.62 TO 3.63 V, -30 °C TO 85 °C, AIROC SERIES

Deep-Dive with AI

DocumentsTechnical Data Sheet EN

Specifications Pricing Series Description Documents

Technical Specifications

Parameters and characteristics for this part

Specification	CYW20835PB1KML1GGF

Current - Receiving	8 mA
Current - Transmitting	18 mA
Data Rate (Max)	2 Mbps
Frequency	2.4 GHz
GPIO	24
Memory Size	384 kB, 2 MB
Modulation	GFSK
Mounting Type	Surface Mount
Operating Temperature [Max]	85 °C
Operating Temperature [Min]	-30 ░C
Package / Case	60-VFQFN Exposed Pad
Power - Output	12 dBm
Protocol	EDGE, WCDMA, GSM, Bluetooth v5.2, CDMA
RF Family/Standard	Bluetooth
Serial Interfaces	UART, PWM, ADC, PCM, I2S, JTAG, HCI, I2C, SPI, GPIO
Supplier Device Package	PG-VQFN-60-800
Type	TxRx + MCU
Voltage - Supply [Max]	1.775 V
Voltage - Supply [Min]	1.625 V

CYW20835 Series

Part	GPIO	Current - Receiving	Supplier Device Package	Protocol	Package / Case	Frequency	Power - Output	Memory Size	Voltage - Supply [Min]	Voltage - Supply [Max]	Operating Temperature [Min]	Operating Temperature [Max]	Mounting Type	Data Rate (Max)	Type	RF Family/Standard	Serial Interfaces	Modulation	Current - Transmitting
Infineon Technologies CYW20835PB1KML1GGF	24	8 mA	PG-VQFN-60-800	Bluetooth v5.2 CDMA EDGE GSM WCDMA	60-VFQFN Exposed Pad	2.4 GHz	12 dBm	2 MB 384 kB	1.625 V	1.775 V	-30 ░C	85 °C	Surface Mount	2 Mbps	TxRx + MCU	Bluetooth	ADC GPIO HCI I2C I2S JTAG PCM PWM SPI UART	GFSK	18 mA

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Tray	1	$ 6.67
		10	$ 6.11
		25	$ 5.56
		80	$ 5.00
		260	$ 4.58
		520	$ 4.17
		1040	$ 3.75
Newark	Each	1	$ 2.93
		10	$ 2.54
		25	$ 2.39
		50	$ 2.31
		100	$ 2.24
		250	$ 2.15
		500	$ 2.08

Description

General part information

CYW20835 Series

The AIROC™ CYW20835 Bluetooth® LE SoC is a Bluetooth® 5.4 core spec compliant device for IoT applications. Manufactured using the industry's advanced 40 nm CMOS low-power process, the CYW20835 employs high levels of integration to minimize external components, reducing the device footprint and the costs associated with implementing Bluetooth® Low Energy solutions. The AIROC™ CYW20835 Bluetooth® LE SoC is designed to support the entire spectrum of Bluetooth® Low Energy use cases for home automation, accessory, sensors (medical, home, security, and industrial), lighting, Bluetooth® Mesh, wireless input devices including game controllers, remote controls, keyboards, and joysticks or any Bluetooth® LE connected IoT application. AIROC™ CYW20835 Modules Infineon's AIROC™ CYW20835 Bluetooth® LE modules are fully integrated with onboard crystal oscillator, passive components, flash memory, and the CYW20835 system on chip. These highly integrated modules are also globally certified to support fast time-to-market. The AIROC™CYBLE-343072-02module and the External Antenna Module version -CYBLE-333073-02andCYBLE-333074-02are supported by the AIROC™ Bluetooth® SDK in ModusToolbox™ software and tools with code examples to support rapid development of embedded Bluetooth® LE applications.

Documents

Technical documentation and resources

Technical Data Sheet EN

Datasheet