SAL1-130-01-S-S-A-TR

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Samtec Inc.

CONN CARD EDGE SKT 30 POS 1MM SOLDER ST SMD SATALINK™ T/R

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Samtec Inc.

CONN CARD EDGE SKT 30 POS 1MM SOLDER ST SMD SATALINK™ T/R

Technical Specifications

Parameters and characteristics for this part

Specification	SAL1-130-01-S-S-A-TR

Card Thickness [Max]	2.36 mm
Card Thickness [Max]	0.093 in
Card Thickness [Min]	1.6 mm
Card Thickness [Min]	0.063 in
Color	Black
Contact Finish	Gold
Contact Finish Thickness	0.76 Ám
Contact Finish Thickness	30 Áin
Contact Material	Beryllium Copper
Features	Solder Retention, Board Guide
Gender	Female
Material - Insulation	Liquid Crystal Polymer (LCP)
Mounting Type	Surface Mount
Number of Positions	30
Number of Positions/Bay/Row [custom]	30
Number of Rows	1
Operating Temperature [Max]	125 °C
Operating Temperature [Min]	-55 °C
Pitch [x]	0.039 in
Pitch [x]	1 mm
Read Out	Single
Termination	Solder

Part	Termination	Mounting Type	Card Thickness [Max]	Card Thickness [Min]	Card Thickness [Min]	Card Thickness [Max]	Read Out	Operating Temperature [Min]	Operating Temperature [Max]	Gender	Number of Positions	Contact Finish Thickness	Contact Finish Thickness	Color	Material - Insulation	Pitch [x]	Pitch [x]	Number of Rows	Number of Positions/Bay/Row [custom]	Contact Material	Contact Finish	Features
Samtec Inc. SAL1-130-01-S-S-A-TR	Solder	Surface Mount	2.36 mm	1.6 mm	0.063 in	0.093 in	Single	-55 °C	125 °C	Female	30	0.76 Ám	30 Áin	Black	Liquid Crystal Polymer (LCP)	0.039 in	1 mm	1	30	Beryllium Copper	Gold	Board Guide Solder Retention

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly