Specification	14-350000-10-HT

Board Material	Polyimide (PI)
Board Thickness	0.062 in
Contact Finish - Mating	Tin
Contact Finish - Post	Tin-Lead
Contact Finish Thickness - Post	200 µin
Contact Material - Post	Brass
Convert From (Adapter End)	SOIC
Convert To (Adapter End) Size	0.3 in
Convert To (Adapter End) Type	DIP, Row Spacing
Material	FR4 Epoxy Glass
Mounting Type	Through Hole
Number of Pins	14 pins
Number of Positions	14
Package Accepted	SOIC
Pitch	0.05 in
Pitch - Mating	0.05 in
Pitch - Post	0.1 in
Proto Board Type	DIP
Termination	Solder
Termination Post Length	0.125 in

14-3500 Series

Part	Number of Pins	Termination	Contact Material - Post	Convert From (Adapter End)	Contact Finish - Post	Convert To (Adapter End) Size	Convert To (Adapter End) Type	Mounting Type	Board Material	Contact Finish Thickness - Post	Pitch - Mating	Pitch - Post	Contact Finish - Mating	Termination Post Length	Board Thickness	Package Accepted	Number of Positions	Proto Board Type	Material	Pitch	Size / Dimension Length	Size / Dimension Width
Aries Electronics 14-350000-10-HT	14 pins	Solder	Brass	SOIC	Tin-Lead	0.3 in	DIP Row Spacing	Through Hole	Polyimide (PI)	200 µin	0.05 in	0.1 in	Tin	0.125 in	0.062 in	SOIC	14	DIP	FR4 Epoxy Glass	0.05 in
Aries Electronics 14-350000-10-P															0.062 in	SOIC	14	DIP SMD	FR4 Epoxy Glass	0.05 in	1.4 in	0.45 in

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