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Description

General part information

BD9859 Series

BD9859EFJ mainly used as secondary side Power supply, for example from fixed Power supply of 9V, 12V etc., Step-down Output of 1.2V/1.8V/3.3V/5V, etc., can be produced. This IC has external Coil/Capacitor down-sizing through 750kHz High Frequency operation, inside Nch-FET SW for 15V "withstand-pressure" commutation and also, High Speed Load Response through Current Mode Control is a simple external setting Phase compensation System, through a wide range external constant, a compact Power supply can be produced easily.

Technical Specifications

Parameters and characteristics for this part

SpecificationBD9859EFJ-E2
Current - Output3 A
Frequency - Switching750 kHz
FunctionStep-Down
Mounting TypeSurface Mount
Number of Outputs1
Operating Temperature (Max)85 °C
Operating Temperature (Min)-40 °C
Output ConfigurationPositive
Output TypeFixed
Package FeaturesExposed Pad
Package Length0.154 in
Package Name8-SOIC, 8-HTSOP-J
Package Width3.9 mm
Synchronous RectifierYes
TopologyBuck
Voltage - Input (Max)14 V
Voltage - Input (Min)5 V
Voltage - Output (Min/Fixed)1 V

Pricing

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CAD

3D models and CAD resources for this part

Documents

Technical documentation and resources

Datasheet
BD9859EFJ-E2 Flammability
HTSOP-J8 Taping Spec
Suppression Method of Switching Noise Using Linear Regulator and Low Pass Filter
Compliance with the ELV directive
PCB Layout Essential Check sheet for Switching Regulator
PCB Layout Thermal Design Guide
Efficiency of Buck Converter
Impedance Characteristics of Bypass Capacitor
Precautions When Measuring the Rear of the Package with a Thermocouple
Types of Capacitors Used for Output Smoothing of Switching Regulators and their Precautions
Diode Selection Method for Asynchronous Converter
Three Steps for Successful Design of DC-DC Converters
What Is Thermal Design
Capacitor Calculation for Buck converter IC
Power Supply Sequence Circuit with General Purpose Power Supply IC
θ<sub>JC</sub> and Ψ<sub>JT</sub>
Solder Joint Rate and Thermal Resistance of Exposed Pad
PCB Layout Techniques of Buck Converter
Considering Input Filter to Reduce Conducted Emissions by DCDC Converter
Method for Determining Constants of Peripheral Parts of Buck DC/DC Converter
Precautions for PCB Layout Regarding Common Mode Filters
Anti-Whisker formation
Considering Polarity of Power Inductor to Reduce Radiated Emission of DC-DC converter
Considerations for Power Inductors Used for Buck Converters
Basics of Thermal Resistance and Heat Dissipation
Judgment Criteria of Thermal Evaluation
θ<sub>JA</sub> and Ψ<sub>JT</sub>
Calculation of Power Dissipation in Switching Circuit
Resistor Value Table to set Output Voltage of Buck Converter IC
The Important Points of Multi-layer Ceramic Capacitor Used in Buck Converter circuit
Design Guide and Example of Stencil for Exposed Pad
Heat Dissipation Effect of Thermal Via in Exposed Pad Type Package
How to Use the Thermal Resistance and Thermal Characteristics Parameters
Inductor Calculation for Buck converter IC
Calculation of Power Loss (Synchronous)
Method for Calculating Junction Temperature from Transient Thermal Resistance Data
How to Use the Two-Resistor Model
Snubber Circuit for Buck Converter IC
Measurement Method for Phase Margin with Frequency Response Analyzer (FRA)
Step-down DC-DC converter PCB layout EMC Design guide
Two-Resistor Model for Thermal Simulation
Phase Compensation Design for Current Mode Buck Converter
Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)
Thermal Resistance
Cutting-Edge Web Simulation Tool "ROHM Solution Simulator" Capable of Complete Circuit Verification of Power Devices and Driver ICs
Factory Information
Five Steps for Successful Thermal Design of IC