
1.5MIC 3M662XW DLF 3MIL TH 5 IN
Active3M (TC)
LAPPING FILM DIAMOND 1.5U 5"
Deep-Dive with AI
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1.5MIC 3M662XW DLF 3MIL TH 5 IN
Active3M (TC)
LAPPING FILM DIAMOND 1.5U 5"
Deep-Dive with AI
Technical Specifications
Parameters and characteristics for this part
| Specification | 1.5MIC 3M662XW DLF 3MIL TH 5 IN |
|---|---|
| Abrasive Material | Diamond |
| Applications | Fiber Optic Connector Polishing |
| Color | Green |
| Diameter [diameter] | 5 " |
| Diameter [diameter] | 127 mm |
| Micron Size | 1.5 µ |
| Type | Lapping Film |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | Bulk | 25 | $ 10.94 | |
Description
General part information
3M662XW Series
Lapping Film Diamond 1.5µ X 5.00" (127.00mm) Dia
Documents
Technical documentation and resources