
BU7442FVM-TR
ActiveRohm Semiconductor
LOW POWER GROUND SENSE OPERATIONAL AMPLIFIER

BU7442FVM-TR
ActiveRohm Semiconductor
LOW POWER GROUND SENSE OPERATIONAL AMPLIFIER
Description
General part information
BU7442 Series
Low Voltage CMOS Op-Amp integrates one or two independent outputs full swing Op-Amps and phase compensation capacitors on a single chip. Especially, this series is operable with low voltage, low supply current and low input bias current.
Technical Specifications
Parameters and characteristics for this part
| Specification | BU7442FVM-TR |
|---|---|
| Amplifier Type | General Purpose |
| Current - Input Bias | 1 pA |
| Current - Output / Channel | 10 mA |
| Current - Supply | 100 µA |
| Gain Bandwidth Product | 600 kHz |
| Mounting Type | Surface Mount |
| Number of Circuits | 2 |
| Operating Temperature (Max) | 85 °C |
| Operating Temperature (Min) | -40 °C |
| Output Type | Rail-to-Rail |
| Package Length | 0.11 in |
| Package Name | 8-MSOP |
| Package Width | 2.8 mm |
| Slew Rate | 0.3 V/µs |
| Voltage - Input Offset | 1 mV |
| Voltage - Supply Span (Max) | 5.5 V |
| Voltage - Supply Span (Min) | 1.7 V |
Pricing
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CAD
3D models and CAD resources for this part
Documents
Technical documentation and resources
Datasheet
Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)
UL94 Flame Classifications of Mold Compound
Anti-Whisker formation
Op-Amp / Comparator Tutorial
Impedance Characteristics of Bypass Capacitor
Basics of Thermal Resistance and Heat Dissipation
Five Steps for Successful Thermal Design of IC
What Is Thermal Design
Design Guide and Example of Stencil for Exposed Pad
Method for Calculating Junction Temperature from Transient Thermal Resistance Data
Factory Information
MSOP8 Package Information
Compliance with the ELV directive
Low-Side Current Sensing Circuit Design
Solder Joint Rate and Thermal Resistance of Exposed Pad
Op amp Circuit Collection
Heat Dissipation Effect of Thermal Via in Exposed Pad Type Package
Thermal Resistance
BD7541, BD7542