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100-022-000

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3M

CONN IC DIP SOCKET 22POS GOLD

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100-022-000

Active
3M

CONN IC DIP SOCKET 22POS GOLD

Deep-Dive with AI

Technical Specifications

Parameters and characteristics commom to parts in this series

Specification100-022-000100-022 Series
Contact Finish - MatingGoldGold
Contact Finish - PostGoldGold
Contact Finish Thickness - Mating0.203 Ám0.203 Ám
Contact Finish Thickness - Mating8 Áin8 Áin
Contact Finish Thickness - PostFlashFlash
Contact Material - MatingBeryllium CopperBeryllium Copper
Contact Material - Post [custom]BrassBrass
Current Rating (Amps)1 A1 A
FeaturesOpen FrameOpen Frame
Housing MaterialPolyphenylene Sulfide (PPS), Glass FilledPolyphenylene Sulfide (PPS), Glass Filled
Material Flammability RatingUL94 V-0UL94 V-0
Mounting TypeThrough HoleThrough Hole
Number of Positions or Pins (Grid)2222
Operating Temperature [Max]125 °C125 °C
Operating Temperature [Min]-65 ░C-65 ░C
Pitch - Mating0.1 in0.1 in
Pitch - Mating2.54 mm2.54 mm
Pitch - Post2.54 mm2.54 mm
Pitch - Post0.1 in0.1 in
TerminationSolderSolder
Termination Post Length3.2 mm3.2 mm
Termination Post Length0.126 in0.126 in
Type0.4 in0.4 in
Type10.16 mm10.16 mm
TypeDIPDIP

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$

100-022 Series

CONN IC DIP SOCKET 22POS GOLD

PartPitch - MatingPitch - MatingContact Finish - MatingOperating Temperature [Max]Operating Temperature [Min]TypeTypeTypeMounting TypeContact Finish Thickness - PostTerminationContact Material - Post [custom]Number of Positions or Pins (Grid)Material Flammability RatingTermination Post LengthTermination Post LengthContact Material - MatingHousing MaterialContact Finish Thickness - MatingContact Finish Thickness - MatingFeaturesCurrent Rating (Amps)Pitch - PostPitch - PostContact Finish - Post
0.1 in
2.54 mm
Gold
125 °C
-65 ░C
0.4 in
10.16 mm
DIP
Through Hole
Flash
Solder
Brass
22
UL94 V-0
3.2 mm
0.126 in
Beryllium Copper
Polyphenylene Sulfide (PPS), Glass Filled
0.203 Ám
8 Áin
Open Frame
1 A
2.54 mm
0.1 in
Gold
0.1 in
2.54 mm
Gold
125 °C
-65 ░C
0.4 in
10.16 mm
DIP
Through Hole
Flash
Solder
Brass
22
UL94 V-0
3.2 mm
0.126 in
Beryllium Copper
Polyphenylene Sulfide (PPS), Glass Filled
0.203 Ám
8 Áin
Open Frame
1 A
2.54 mm
0.1 in
Gold

Description

General part information

100-022 Series

22 (2 x 11) Pos DIP, 0.4" (10.16mm) Row Spacing Socket Gold Through Hole

Documents

Technical documentation and resources

No documents available