
TEM-130-02-04.0-H-D-A-K
ActiveSamtec Inc.
2 GOLD 1.6MM -55℃~+125℃ PHOSPHOR BRONZE VERTICAL WELDING SMD WIRE TO BOARD CONNECTOR ROHS
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TEM-130-02-04.0-H-D-A-K
ActiveSamtec Inc.
2 GOLD 1.6MM -55℃~+125℃ PHOSPHOR BRONZE VERTICAL WELDING SMD WIRE TO BOARD CONNECTOR ROHS
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Technical Specifications
Parameters and characteristics for this part
| Specification | TEM-130-02-04.0-H-D-A-K |
|---|---|
| Connector Type | Header |
| Contact Finish - Mating | Gold |
| Contact Finish - Post | Gold |
| Contact Finish Thickness - Mating | 30 Áin |
| Contact Finish Thickness - Mating | 0.76 Ám |
| Contact Finish Thickness - Post | 3 µin |
| Contact Finish Thickness - Post | 0.076 µm |
| Contact Material | Phosphor Bronze |
| Contact Shape | Square |
| Contact Type | Male Pin |
| Current Rating (Amps) | 2.9 A |
| Fastening Type | Push-Pull |
| Features | Pick and Place, Board Guide |
| Insulation Color | Black |
| Insulation Height | 0.26 in |
| Insulation Height | 6.6 mm |
| Insulation Material | Liquid Crystal Polymer (LCP) |
| Mated Stacking Heights | 7 mm |
| Mounting Type | Surface Mount |
| Number of Positions | 60 |
| Number of Positions Loaded | All |
| Number of Rows | 2 |
| Operating Temperature [Max] | 125 °C |
| Operating Temperature [Min] | -55 °C |
| Pitch - Mating | 0.031 in |
| Pitch - Mating | 0.8 mm |
| Row Spacing - Mating [x] | 1.6 mm |
| Row Spacing - Mating [x] | 0.063 in |
| Shrouding | Shrouded - 4 Wall |
| Termination | Solder |
TEM-130 Series
| Part | Number of Positions | Contact Finish - Post | Connector Type | Contact Material | Contact Finish - Mating | Current Rating (Amps) | Row Spacing - Mating [x] | Row Spacing - Mating [x] | Number of Rows | Insulation Color | Insulation Height | Insulation Height | Contact Type | Contact Length - Mating | Contact Length - Mating | Insulation Material | Mounting Type | Features | Pitch - Mating | Pitch - Mating | Contact Shape | Shrouding | Operating Temperature [Min] | Operating Temperature [Max] | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Termination | Number of Positions Loaded | Fastening Type | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Mated Stacking Heights |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc. | 60 | Tin | Header | Phosphor Bronze | Gold | 2.9 A | 1.6 mm | 0.063 in | 2 | Black | 6 mm | 0.236 in | Male Pin | 0.116 in | 2.95 mm | Liquid Crystal Polymer (LCP) | Surface Mount Right Angle | Board Guide | 0.031 in | 0.8 mm | Square | Shrouded - 4 Wall | -55 °C | 125 °C | 3 µin | 0.076 µm | Solder | All | Push-Pull | |||
Samtec Inc. | 60 | Gold | Header | Phosphor Bronze | Gold | 2.9 A | 1.6 mm | 0.063 in | 2 | Black | Male Pin | Liquid Crystal Polymer (LCP) | Surface Mount | Board Guide Pick and Place | 0.031 in | 0.8 mm | Square | Shrouded - 4 Wall | -55 °C | 125 °C | 30 Áin | 0.76 Ám | Solder | All | Push-Pull | 3 µin | 0.076 µm | 10 mm | ||||
Samtec Inc. | 60 | Gold | Header | Phosphor Bronze | Gold | 2.9 A | 1.6 mm | 0.063 in | 2 | Black | Male Pin | Liquid Crystal Polymer (LCP) | Surface Mount | Pick and Place | 0.031 in | 0.8 mm | Square | Shrouded - 4 Wall | -55 °C | 125 °C | 30 Áin | 0.76 Ám | Solder | All | Push-Pull | 3 µin | 0.076 µm | 10 mm | ||||
Samtec Inc. | 60 | Gold | Header | Phosphor Bronze | Gold | 2.9 A | 1.6 mm | 0.063 in | 2 | Black | Male Pin | Liquid Crystal Polymer (LCP) | Surface Mount | Board Guide | 0.031 in | 0.8 mm | Square | Shrouded - 4 Wall | -55 °C | 125 °C | 10 çin | 0.25 çm | Solder | All | Push-Pull | 3 µin | 0.076 µm | 10 mm | ||||
Samtec Inc. | 60 | Gold | Header | Phosphor Bronze | Gold | 2.9 A | 1.6 mm | 0.063 in | 2 | Black | Male Pin | Liquid Crystal Polymer (LCP) | Surface Mount | Board Guide Pick and Place | 0.031 in | 0.8 mm | Square | Shrouded - 4 Wall | -55 °C | 125 °C | 3 µin | 0.076 µm | Solder | All | Push-Pull | 3 µin | 0.076 µm | 10 mm | ||||
Samtec Inc. | 60 | Tin | Header | Phosphor Bronze | Gold | 2.9 A | 1.6 mm | 0.063 in | 2 | Black | 6 mm | 0.236 in | Male Pin | 0.116 in | 2.95 mm | Liquid Crystal Polymer (LCP) | Surface Mount Right Angle | 0.031 in | 0.8 mm | Square | Shrouded - 4 Wall | -55 °C | 125 °C | 30 Áin | 0.76 Ám | Solder | All | Push-Pull | ||||
Samtec Inc. | 60 | Gold | Header | Phosphor Bronze | Gold | 2.9 A | 1.6 mm | 0.063 in | 2 | Black | 5.6 mm | 0.22 in | Male Pin | Liquid Crystal Polymer (LCP) | Surface Mount | Board Guide Pick and Place | 0.031 in | 0.8 mm | Square | Shrouded - 4 Wall | -55 °C | 125 °C | 30 Áin | 0.76 Ám | Solder | All | Push-Pull | 3 µin | 0.076 µm | 6 mm | ||
Samtec Inc. | 60 | Gold | Header | Phosphor Bronze | Gold | 2.9 A | 1.6 mm | 0.063 in | 2 | Black | 6.6 mm | 0.26 in | Male Pin | Liquid Crystal Polymer (LCP) | Surface Mount | Board Guide Pick and Place | 0.031 in | 0.8 mm | Square | Shrouded - 4 Wall | -55 °C | 125 °C | 30 Áin | 0.76 Ám | Solder | All | Push-Pull | 3 µin | 0.076 µm | 7 mm | ||
Samtec Inc. | 60 | Gold | Header | Phosphor Bronze | Gold | 2.9 A | 1.6 mm | 0.063 in | 2 | Black | 5.6 mm | 0.22 in | Male Pin | Liquid Crystal Polymer (LCP) | Surface Mount | Pick and Place | 0.031 in | 0.8 mm | Square | Shrouded - 4 Wall | -55 °C | 125 °C | 30 Áin | 0.76 Ám | Solder | All | Push-Pull | 3 µin | 0.076 µm | 6 mm | ||
Samtec Inc. | 60 | Gold | Header | Phosphor Bronze | Gold | 2.9 A | 1.6 mm | 0.063 in | 2 | Black | 5.6 mm | 0.22 in | Male Pin | Liquid Crystal Polymer (LCP) | Surface Mount | Board Guide | 0.031 in | 0.8 mm | Square | Shrouded - 4 Wall | -55 °C | 125 °C | 30 Áin | 0.76 Ám | Solder | All | Push-Pull | 3 µin | 0.076 µm | 6 mm |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
Description
General part information
TEM-130 Series
Connector Header Surface Mount 60 position 0.031" (0.80mm)
Documents
Technical documentation and resources
No documents available