84-PRS11010-12

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Aries Electronics

ZIF 11X11 84PIN FOOTPRN 11010

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84-PRS11010-12

Active

Aries Electronics

ZIF 11X11 84PIN FOOTPRN 11010

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Specifications Pricing Series Description Documents

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	-	6	$ 76.92

Description

General part information

84-PRS1 Series

Pos PGA, ZIF (ZIP) Socket Gold Through Hole

Documents

Technical documentation and resources

No documents available

Technical Specifications

Parameters and characteristics commom to parts in this series

Specification	84-PRS11010-12	84-PRS1 Series

Contact Finish - Mating	Gold	Gold
Contact Finish - Post	Tin	Tin
Contact Finish Thickness - Mating	30 Áin	30 Áin
Contact Finish Thickness - Mating	0.76 Ám	0.76 Ám
Contact Finish Thickness - Post	200 µin	200 µin
Contact Finish Thickness - Post	5.08 µm	5.08 µm
Contact Material - Mating	Beryllium Copper	Beryllium Copper
Contact Material - Post	Beryllium Copper	Beryllium Copper
Current Rating (Amps)	1 A	1 A
Features	Closed Frame	Closed Frame
Material Flammability Rating	UL94 V-0	UL94 V-0
Mounting Type	Through Hole	Through Hole
Operating Temperature	-	125 °C
Operating Temperature	-	-65 ░C
Pitch - Mating	0.1 in	0.1 in
Pitch - Mating	2.54 mm	2.54 mm
Pitch - Post	2.54 mm	2.54 mm
Pitch - Post	0.1 in	0.1 in
Termination	Solder	Solder
Termination Post Length	3.18 mm	3.18 mm
Termination Post Length	0.125 in	0.125 in
Type	ZIF (ZIP), PGA	ZIF (ZIP), PGA

84-PRS1 Series

PGA GOLD BERYLLIUM COPPER ALLOY -65℃~+125℃ 2.54MM PLUGIN IC / TRANSISTOR SOCKET ROHS

Part	Current Rating (Amps)	Contact Material - Post	Material Flammability Rating	Operating Temperature [Max]	Operating Temperature [Min]	Mounting Type	Contact Material - Mating	Features	Termination Post Length	Termination Post Length	Pitch - Post	Pitch - Post	Contact Finish - Post	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Type	Pitch - Mating	Pitch - Mating	Termination
Aries Electronics 84-PRS11032-12	1 A	Beryllium Copper	UL94 V-0	125 °C	-65 ░C	Through Hole	Beryllium Copper	Closed Frame	3.18 mm	0.125 in	2.54 mm	0.1 in	Tin	Gold	30 Áin	0.76 Ám	200 µin	5.08 µm	PGA, ZIF (ZIP)	0.1 in	2.54 mm	Solder
Aries Electronics 84-PRS10003-12	1 A	Beryllium Copper	UL94 V-0	125 °C	-65 ░C	Through Hole	Beryllium Copper	Closed Frame	3.18 mm	0.125 in	2.54 mm	0.1 in	Tin	Gold	30 Áin	0.76 Ám	200 µin	5.08 µm	PGA, ZIF (ZIP)	0.1 in	2.54 mm	Solder
Aries Electronics 84-PRS11010-12	1 A	Beryllium Copper	UL94 V-0			Through Hole	Beryllium Copper	Closed Frame	3.18 mm	0.125 in	2.54 mm	0.1 in	Tin	Gold	30 Áin	0.76 Ám	200 µin	5.08 µm	PGA, ZIF (ZIP)	0.1 in	2.54 mm	Solder
Aries Electronics 84-PRS13125-12	1 A	Beryllium Copper	UL94 V-0	125 °C	-65 ░C	Through Hole	Beryllium Copper	Closed Frame	3.18 mm	0.125 in	2.54 mm	0.1 in	Tin	Gold	30 Áin	0.76 Ám	200 µin	5.08 µm	PGA, ZIF (ZIP)	0.1 in	2.54 mm	Solder
Aries Electronics 84-PRS12022-12	1 A	Beryllium Copper	UL94 V-0	125 °C	-65 ░C	Through Hole	Beryllium Copper	Closed Frame	3.18 mm	0.125 in	2.54 mm	0.1 in	Tin	Gold	30 Áin	0.76 Ám	200 µin	5.08 µm	PGA, ZIF (ZIP)	0.1 in	2.54 mm	Solder
Aries Electronics 84-PRS13053-12	1 A	Beryllium Copper	UL94 V-0	125 °C	-65 ░C	Through Hole	Beryllium Copper	Closed Frame	3.18 mm	0.125 in	2.54 mm	0.1 in	Tin	Gold	30 Áin	0.76 Ám	200 µin	5.08 µm	PGA, ZIF (ZIP)	0.1 in	2.54 mm	Solder