TPSM53602RDAR
Active36-V, 2-A STEP-DOWN POWER MODULE IN SMALL 5.5 X 5 X 4-MM ENHANCED HOTROD™ QFN WITH SIMPLE FOOTPRINT
Deep-Dive with AI
Search across all available documentation for this part.
TPSM53602RDAR
Active36-V, 2-A STEP-DOWN POWER MODULE IN SMALL 5.5 X 5 X 4-MM ENHANCED HOTROD™ QFN WITH SIMPLE FOOTPRINT
Technical Specifications
Parameters and characteristics commom to parts in this series
| Specification | TPSM53602RDAR | TPSM53602 Series |
|---|---|---|
| Applications | ITE (Commercial) | ITE (Commercial) |
| Board Type | - | Fully Populated |
| Control Features | Enable, Active High | Enable, Active High |
| Current - Output | - | 2 A |
| Current - Output (Max) [Max] | 2 A | 2 A |
| Efficiency | 95 % | 95 % |
| Features | Adjustable Output | Adjustable Output |
| Main Purpose | - | DC/DC, Step Down |
| Mounting Type | Surface Mount | Surface Mount |
| Number of Outputs | 1 | 1 |
| Operating Temperature [Max] | 105 ░C | 105 ░C |
| Operating Temperature [Min] | -40 °C | -40 °C |
| Outputs and Type | - | Non-Isolated |
| Outputs and Type | - | 1 |
| Package / Case | 15-PowerBQFN Module | 15-PowerBQFN Module |
| Size / Dimension [x] | 0.22 in | 0.22 in |
| Size / Dimension [x] | 5.5 mm | 5.5 mm |
| Size / Dimension [y] | 5 mm | 5 mm |
| Size / Dimension [y] | 0.2 in | 0.2 in |
| Size / Dimension [z] | 0.16 " | 0.16 " |
| Size / Dimension [z] | 4.1 mm | 4.1 mm |
| Supplied Contents | - | Board(s) |
| Supplier Device Package | 15-B3QFN (5x5.5) | 15-B3QFN (5x5.5) |
| Type | Non-Isolated PoL Module | Non-Isolated PoL Module |
| Utilized IC / Part | - | TPSM53602 |
| Voltage - Input | - | 36 V |
| Voltage - Input | - | 3.8 V |
| Voltage - Input (Max) [Max] | 36 V | 36 V |
| Voltage - Input (Min) [Min] | 3.8 V | 3.8 V |
| Voltage - Output | - | 5V, 1.2V, 2.5V, 1.8V, 3.3V |
| Voltage - Output 1 [Max] | 7 V | 7 V |
| Voltage - Output 1 [Min] | 1 V | 1 V |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
TPSM53602 Series
EVAL BOARD FOR TPSM53602
| Part | Outputs and Type | Outputs and Type | Supplied Contents | Current - Output | Voltage - Input [Max] | Voltage - Input [Min] | Board Type | Main Purpose | Voltage - Output | Utilized IC / Part | Supplier Device Package | Features | Type | Voltage - Input (Min) [Min] | Number of Outputs | Operating Temperature [Min] | Operating Temperature [Max] | Size / Dimension [x] | Size / Dimension [z] | Size / Dimension [z] | Size / Dimension [y] | Size / Dimension [y] | Size / Dimension [x] | Control Features | Efficiency | Applications | Current - Output (Max) [Max] | Voltage - Input (Max) [Max] | Voltage - Output 1 [Min] | Voltage - Output 1 [Max] | Mounting Type | Package / Case |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Non-Isolated | 1 | Board(s) | 2 A | 36 V | 3.8 V | Fully Populated | DC/DC, Step Down | 1.2V, 1.8V, 2.5V, 3.3V, 5V | TPSM53602 | |||||||||||||||||||||||
Texas Instruments TPSM53602RDARThe TPSM53602 power module is a highly integrated 2-A power solution that combines a 36-V input, step-down, DC/DC converter with power MOSFETs, a shielded inductor, and passives in a thermally-enhanced QFN package. The 5-mm x 5.5-mm x 4-mm, 15-pin package usesEnhanced HotRod QFNtechnology for improved thermal performance, small footprint, and low EMI. The package footprint has all pins accessible from the perimeter and a single large thermal pad for simple layout and easy handling in manufacturing.
The total solution requires as few as four external components and eliminates the loop compensation and magnetics part selection from the design process. The full feature set includes power good, programmable UVLO, prebias start-up, overcurrent, and overtemperature protections, making the TPSM53602 an excellent device for powering a wide range of applications.
The TPSM53602 power module is a highly integrated 2-A power solution that combines a 36-V input, step-down, DC/DC converter with power MOSFETs, a shielded inductor, and passives in a thermally-enhanced QFN package. The 5-mm x 5.5-mm x 4-mm, 15-pin package usesEnhanced HotRod QFNtechnology for improved thermal performance, small footprint, and low EMI. The package footprint has all pins accessible from the perimeter and a single large thermal pad for simple layout and easy handling in manufacturing.
The total solution requires as few as four external components and eliminates the loop compensation and magnetics part selection from the design process. The full feature set includes power good, programmable UVLO, prebias start-up, overcurrent, and overtemperature protections, making the TPSM53602 an excellent device for powering a wide range of applications. | 15-B3QFN (5x5.5) | Adjustable Output | Non-Isolated PoL Module | 3.8 V | 1 | -40 °C | 105 ░C | 0.22 in | 0.16 " | 4.1 mm | 5 mm | 0.2 in | 5.5 mm | Active High, Enable | 95 % | ITE (Commercial) | 2 A | 36 V | 1 V | 7 V | Surface Mount | 15-PowerBQFN Module |
Description
General part information
TPSM53602 Series
The TPSM53602 power module is a highly integrated 2-A power solution that combines a 36-V input, step-down, DC/DC converter with power MOSFETs, a shielded inductor, and passives in a thermally-enhanced QFN package. The 5-mm x 5.5-mm x 4-mm, 15-pin package usesEnhanced HotRod QFNtechnology for improved thermal performance, small footprint, and low EMI. The package footprint has all pins accessible from the perimeter and a single large thermal pad for simple layout and easy handling in manufacturing.
The total solution requires as few as four external components and eliminates the loop compensation and magnetics part selection from the design process. The full feature set includes power good, programmable UVLO, prebias start-up, overcurrent, and overtemperature protections, making the TPSM53602 an excellent device for powering a wide range of applications.
The TPSM53602 power module is a highly integrated 2-A power solution that combines a 36-V input, step-down, DC/DC converter with power MOSFETs, a shielded inductor, and passives in a thermally-enhanced QFN package. The 5-mm x 5.5-mm x 4-mm, 15-pin package usesEnhanced HotRod QFNtechnology for improved thermal performance, small footprint, and low EMI. The package footprint has all pins accessible from the perimeter and a single large thermal pad for simple layout and easy handling in manufacturing.
Documents
Technical documentation and resources