Specification	TMJ03DKSD-S1512

Contact Finish - Mating	Gold
Contact Finish - Post	Gold
Contact Finish Thickness - Mating	30 µin
Contact Finish Thickness - Post	30 µin
Contact Material - Mating	Beryllium Copper
Contact Material - Post	Beryllium Copper
Contact Resistance	30 mOhm
Current Rating	3 A
Features	Flange
Housing Material	PPS, Polyphenylene Sulfide
Mounting Type	Through Hole
Number of Positions or Pins (Grid)	3
Number of Positions or Pins (Grid) Shape	Rectangular
Operating Temperature (Max)	175 °C
Operating Temperature (Min)	-50 °C
Pitch - Mating	0.15 in
Pitch - Post	0.15 in
Termination	Solder
Type	Transistor, TO-254

TMJ03 Series

Part	Current Rating	Contact Resistance	Pitch - Mating	Mounting Type	Type	Features	Termination	Contact Material - Mating	Contact Finish Thickness - Post	Contact Finish Thickness - Mating	Number of Positions or Pins (Grid) Shape	Number of Positions or Pins (Grid)	Contact Finish - Mating	Operating Temperature (Max)	Operating Temperature (Min)	Pitch - Post	Housing Material	Contact Material - Post	Contact Finish - Post
Sullins Connector Solutions TMJ03DKSD-S1512	3 A	30 mOhm	0.15 in	Through Hole	TO-254 Transistor	Flange	Solder	Beryllium Copper	30 µin	30 µin	Rectangular	3	Gold	175 °C	-50 °C	0.15 in	Polyphenylene Sulfide PPS	Beryllium Copper	Gold

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