HSS-C52-NP-SMT-TR

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CUI Devices

HEAT SINK TO-252 COPPER

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CUI Devices

HEAT SINK TO-252 COPPER

Technical Specifications

Parameters and characteristics for this part

Specification	HSS-C52-NP-SMT-TR

Fin Height	0.4 "
Fin Height	10.16 mm
Length	8 mm
Length	0.315 in
Material	Copper
Material Finish	Tin
Package Cooled	TO-252
Package Cooled	DPak
Power Dissipation @ Temperature Rise	2.1 W, 75 °C
Shape	Rectangular, Fins
Thermal Resistance @ Forced Air Flow	10.05 °C/W
Thermal Resistance @ Natural	35.71 °C/W
Type	Top Mount
Width [y]	22.86 mm
Width [y]	0.9 in

Part	Shape	Width [y]	Width [y]	Material Finish	Thermal Resistance @ Natural	Power Dissipation @ Temperature Rise	Material	Thermal Resistance @ Forced Air Flow	Type	Package Cooled	Package Cooled	Fin Height	Fin Height	Length	Length
CUI Devices HSS-C52-NP-SMT-TR	Rectangular Fins	22.86 mm	0.9 in	Tin	35.71 °C/W	2.1 W 75 °C	Copper	10.05 °C/W	Top Mount	TO-252	DPak	0.4 "	10.16 mm	8 mm	0.315 in

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Tape & Reel (TR)	5000	$ 0.65

General part information

Heat Sink TO-252 (DPak) Copper 2.1W @ 75°C Top Mount

Technical documentation and resources