116-87-432-41-007101

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Preci-Dip

CONN IC DIP SOCKET 32POS GOLD

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116-87-432-41-007101

Active

Preci-Dip

CONN IC DIP SOCKET 32POS GOLD

Deep-Dive with AI

Specifications Pricing Series Description Documents

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Bulk	546	$ 3.32

Description

General part information

116-87 Series

32 (2 x 16) Pos DIP, 0.4" (10.16mm) Row Spacing Socket Gold Through Hole

Documents

Technical documentation and resources

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Technical Specifications

Parameters and characteristics commom to parts in this series

Specification	116-87-432-41-007101	116-87 Series

Contact Finish - Mating	Gold	Gold
Contact Finish - Post	Tin	Tin
Contact Finish Thickness - Mating	Flash	Flash
Contact Material - Mating	Beryllium Copper	Beryllium Copper
Contact Material - Post [custom]	Brass	Brass
Contact Resistance	10 mOhm	10 mOhm
Current Rating (Amps)	1 A	1 A
Features	Open Frame, Elevated	Open Frame, Elevated
Housing Material	Glass Filled, Polyester, Polycyclohexylenedimethylene Terephthalate (PCT)	Glass Filled, Polyester, Polycyclohexylenedimethylene Terephthalate (PCT)
Material Flammability Rating	UL94 V-0	UL94 V-0
Mounting Type	Through Hole	Through Hole
Number of Positions or Pins (Grid)	-	2 - 48
Number of Positions or Pins (Grid)	-	10
Number of Positions or Pins (Grid)	-	4
Number of Positions or Pins (Grid)	-	2
Number of Positions or Pins (Grid)	-	6 - 50
Number of Positions or Pins (Grid)	-	3 - 20
Number of Positions or Pins (Grid)	-	25
Number of Positions or Pins (Grid) [custom]	2 x 16	2 x 16, 2 x 5
Number of Positions or Pins (Grid) [custom]	32	32
Operating Temperature [Max]	125 °C	125 °C
Operating Temperature [Min]	-55 °C	-55 °C
Pitch - Mating	0.1 in	0.1 in
Pitch - Mating	2.54 mm	2.54 mm
Pitch - Post	2.54 mm	2.54 mm
Pitch - Post	0.1 in	0.1 in
Termination	Solder	Solder
Termination Post Length	3.18 mm	3.18 mm
Termination Post Length	0.125 in	0.125 in
Type	0.4 in	0.2 - 0.6 in
Type	10.16 mm	5.08 - 15.24 mm
Type	DIP	DIP

116-87 Series

CONN IC DIP SOCKET 32POS GOLD

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Part	Material Flammability Rating	Contact Material - Post [custom]	Contact Finish - Post	Termination	Mounting Type	Termination Post Length	Termination Post Length	Housing Material	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]	Contact Material - Mating	Operating Temperature [Min]	Operating Temperature [Max]	Contact Finish Thickness - Mating	Pitch - Post	Pitch - Post	Contact Resistance	Pitch - Mating	Pitch - Mating	Contact Finish - Mating	Features	Type	Type	Type	Current Rating (Amps)	Number of Positions or Pins (Grid)	Number of Positions or Pins (Grid) [custom]
Preci-Dip 116-87-432-41-003101	UL94 V-0	Brass	Tin	Solder	Through Hole	3.18 mm	0.125 in	Glass Filled, Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	2 x 16	32	Beryllium Copper	-55 °C	125 °C	Flash	2.54 mm	0.1 in	10 mOhm	0.1 in	2.54 mm	Gold	Elevated, Open Frame	0.4 in	10.16 mm	DIP	1 A
Preci-Dip 116-87-628-41-009101	UL94 V-0	Brass	Tin	Solder	Through Hole	3.18 mm	0.125 in	Glass Filled, Polycyclohexylenedimethylene Terephthalate (PCT), Polyester			Beryllium Copper	-55 °C	125 °C	Flash	2.54 mm	0.1 in	10 mOhm	0.1 in	2.54 mm	Gold	Elevated, Open Frame	0.6 in	15.24 mm	DIP	1 A	28
Preci-Dip 116-87-308-41-004101	UL94 V-0	Brass	Tin	Solder	Through Hole	3.18 mm	0.125 in	Glass Filled, Polycyclohexylenedimethylene Terephthalate (PCT), Polyester			Beryllium Copper	-55 °C	125 °C	Flash	2.54 mm	0.1 in	10 mOhm	0.1 in	2.54 mm	Gold	Elevated, Open Frame	0.3 "	7.62 mm	DIP	1 A	8
Preci-Dip 116-87-424-41-001101	UL94 V-0	Brass	Tin	Solder	Through Hole	3.18 mm	0.125 in	Glass Filled, Polycyclohexylenedimethylene Terephthalate (PCT), Polyester			Beryllium Copper	-55 °C	125 °C	Flash	2.54 mm	0.1 in	10 mOhm	0.1 in	2.54 mm	Gold	Elevated, Open Frame	0.4 in	10.16 mm	DIP	1 A	24
Preci-Dip 116-87-422-41-009101	UL94 V-0	Brass	Tin	Solder	Through Hole	3.18 mm	0.125 in	Glass Filled, Polycyclohexylenedimethylene Terephthalate (PCT), Polyester			Beryllium Copper	-55 °C	125 °C	Flash	2.54 mm	0.1 in	10 mOhm	0.1 in	2.54 mm	Gold	Elevated, Open Frame	0.4 in	10.16 mm	DIP	1 A	22
Preci-Dip 116-87-320-41-011101	UL94 V-0	Brass	Tin	Solder	Through Hole	3.18 mm	0.125 in	Glass Filled, Polycyclohexylenedimethylene Terephthalate (PCT), Polyester			Beryllium Copper	-55 °C	125 °C	Flash	2.54 mm	0.1 in	10 mOhm	0.1 in	2.54 mm	Gold	Elevated, Open Frame	0.3 "	7.62 mm	DIP	1 A	20
Preci-Dip 116-87-310-41-003101	UL94 V-0	Brass	Tin	Solder	Through Hole	3.18 mm	0.125 in	Glass Filled, Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	2 x 5		Beryllium Copper	-55 °C	125 °C	Flash	2.54 mm	0.1 in	10 mOhm	0.1 in	2.54 mm	Gold	Elevated, Open Frame	0.3 "	7.62 mm	DIP	1 A		10
Preci-Dip 116-87-642-41-009101	UL94 V-0	Brass	Tin	Solder	Through Hole	3.18 mm	0.125 in	Glass Filled, Polycyclohexylenedimethylene Terephthalate (PCT), Polyester			Beryllium Copper	-55 °C	125 °C	Flash	2.54 mm	0.1 in	10 mOhm	0.1 in	2.54 mm	Gold	Elevated, Open Frame	0.6 in	15.24 mm	DIP	1 A	42
Preci-Dip 116-87-310-41-008101	UL94 V-0	Brass	Tin	Solder	Through Hole	3.18 mm	0.125 in	Glass Filled, Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	2 x 5		Beryllium Copper	-55 °C	125 °C	Flash	2.54 mm	0.1 in	10 mOhm	0.1 in	2.54 mm	Gold	Elevated, Open Frame	0.3 "	7.62 mm	DIP	1 A		10
Preci-Dip 116-87-632-41-012101	UL94 V-0	Brass	Tin	Solder	Through Hole	3.18 mm	0.125 in	Glass Filled, Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	2 x 16	32	Beryllium Copper	-55 °C	125 °C	Flash	2.54 mm	0.1 in	10 mOhm	0.1 in	2.54 mm	Gold	Elevated, Open Frame	0.6 in	15.24 mm	DIP	1 A