GD25LE32ESIGR

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GigaDevice Semiconductor (HK) Limited

IC FLASH 32MBIT SPI/QUAD 8SOP

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GD25LE32ESIGR

Active

GigaDevice Semiconductor (HK) Limited

IC FLASH 32MBIT SPI/QUAD 8SOP

Deep-Dive with AI

DocumentsDatasheet

Specifications Pricing Series Description Documents

Technical Specifications

Parameters and characteristics for this part

Specification	GD25LE32ESIGR

Access Time	6 ns
Clock Frequency	133 MHz
Memory Format	FLASH
Memory Interface	Quad I/O, QPI, SPI
Memory Organization	4M x 8
Memory Size	32 Gbit
Memory Type	Non-Volatile
Mounting Type	Surface Mount
Operating Temperature [Max]	85 °C
Operating Temperature [Min]	-40 °C
Package / Case	8-SOIC
Package / Case [x]	0.209 "
Package / Case [y]	5.3 mm
Supplier Device Package	8-SOP
Technology	FLASH - NOR (SLC)
Voltage - Supply [Max]	2 V
Voltage - Supply [Min]	1.65 V
Write Cycle Time - Word, Page [custom]	60 µs
Write Cycle Time - Word, Page [custom]	2.4 ms

GD25LE32 Series

Part	Write Cycle Time - Word, Page [custom]	Write Cycle Time - Word, Page [custom]	Memory Type	Mounting Type	Memory Format	Technology	Access Time	Voltage - Supply [Max]	Voltage - Supply [Min]	Supplier Device Package	Operating Temperature [Max]	Operating Temperature [Min]	Memory Size	Memory Organization	Clock Frequency	Memory Interface	Package / Case [y]	Package / Case	Package / Case [x]	Write Cycle Time - Word, Page
GigaDevice Semiconductor (HK) Limited GD25LE32ESIGR	60 µs	2.4 ms	Non-Volatile	Surface Mount	FLASH	FLASH - NOR (SLC)	6 ns	2 V	1.65 V	8-SOP	85 °C	-40 °C	32 Gbit	4M x 8	133 MHz	QPI Quad I/O SPI	5.3 mm	8-SOIC	0.209 "
GigaDevice Semiconductor (HK) Limited GD25LE32ELIGR	60 µs	2.4 ms	Non-Volatile	Surface Mount	FLASH	FLASH - NOR (SLC)	6 ns	2 V	1.65 V	10-WLCSP	85 °C	-40 °C	32 Gbit	4M x 8	133 MHz	QPI Quad I/O SPI		10-XFBGA WLCSP
GigaDevice Semiconductor (HK) Limited GD25LE32ENIGR	60 µs	2.4 ms	Non-Volatile	Surface Mount	FLASH	FLASH - NOR (SLC)	6 ns	2 V	1.65 V	8-USON (3x4)	85 °C	-40 °C	32 Gbit	4M x 8	133 MHz	QPI Quad I/O SPI		8-UDFN Exposed Pad
GigaDevice Semiconductor (HK) Limited GD25LE32EEEGR	100 µs	4 ms	Non-Volatile	Surface Mount	FLASH	FLASH - NOR (SLC)	6 ns	2 V	1.65 V	8-USON (3x2)	125 °C	-40 °C	32 Gbit	4M x 8	133 MHz	QPI Quad I/O SPI		8-XFDFN Exposed Pad
GigaDevice Semiconductor (HK) Limited GD25LE32DLIGR			Non-Volatile	Surface Mount	FLASH	FLASH - NOR		2 V	1.65 V		85 °C	-40 °C	32 Gbit	4M x 8	120 MHz	SPI - Quad I/O		21-XFBGA WLSCP		2.4 ms
GigaDevice Semiconductor (HK) Limited GD25LE32EQIGR	60 µs	2.4 ms	Non-Volatile	Surface Mount	FLASH	FLASH - NOR (SLC)	6 ns	2 V	1.65 V	8-USON (4x4)	85 °C	-40 °C	32 Gbit	4M x 8	133 MHz	QPI Quad I/O SPI		8-XDFN Exposed Pad

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Cut Tape (CT)	1	$ 1.04
		10	$ 0.95
		25	$ 0.93
		50	$ 0.93
		100	$ 0.83
		250	$ 0.82
		500	$ 0.81
		1000	$ 0.78
	Digi-Reel®	1	$ 1.04
		10	$ 0.95
		25	$ 0.93
		50	$ 0.93
		100	$ 0.83
		250	$ 0.82
		500	$ 0.81
		1000	$ 0.78
	Tape & Reel (TR)	2000	$ 0.56

Description

General part information

GD25LE32 Series

FLASH - NOR (SLC) Memory IC 32Mbit SPI - Quad I/O, QPI 133 MHz 6 ns 8-SOP

Documents

Technical documentation and resources