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BD9P233MUF-CE2

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Rohm Semiconductor

NANO PULSE CONTROL™, 3.0V TO 36V INPUT, 2.0A INTEGRATED FET SINGLE SYNCHRONOUS QUIESCENT OPERATING CURRENT BUCK DC/DC CONVERTER FOR AUTOMOTIVE

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Product dimension image

BD9P233MUF-CE2

Active
Rohm Semiconductor

NANO PULSE CONTROL™, 3.0V TO 36V INPUT, 2.0A INTEGRATED FET SINGLE SYNCHRONOUS QUIESCENT OPERATING CURRENT BUCK DC/DC CONVERTER FOR AUTOMOTIVE

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Description

General part information

BD9P233MUF-C Series

BD9P233MUF-C is an ultra-low IQ Buck converter for 3.3V output. The LLM (Light Load Mode) control ensures an ultra-low quiescent current and high efficiency at light load situation as well as at high load situations while maintaining a regulated output voltage.

Technical Specifications

Parameters and characteristics for this part

SpecificationBD9P233MUF-CE2
Current - Output2 A
Frequency - Switching (Max)2.4 MHz
Frequency - Switching (Min)200 kHz
FunctionStep-Down
GradeAutomotive
Mounting TypeWettable Flank, Surface Mount
Number of Outputs1
Operating Temperature (Max)125 °C
Operating Temperature (Min)-40 °C
Output ConfigurationPositive
Output TypeFixed
Package / Case32-VFQFN Exposed Pad
Package NameVQFN32FAV050
QualificationAEC-Q100
Synchronous RectifierYes
TopologyBuck
Voltage - Input (Max)36 V
Voltage - Input (Min)3 V
Voltage - Output (Min/Fixed)3.3 V

Pricing

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CAD

3D models and CAD resources for this part

Documents

Technical documentation and resources

Datasheet
PCB Layout Essential Check sheet for Switching Regulator
Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)
Two-Resistor Model for Thermal Simulation
Efficiency of Buck Converter
Impedance Characteristics of Bypass Capacitor
Bootstrap Circuit in the Buck Converter
VQFN32FAV050 Package Information
Precautions When Measuring the Rear of the Package with a Thermocouple
Basics of Thermal Resistance and Heat Dissipation
Factory Information
Judgment Criteria of Thermal Evaluation
Snubber Circuit for Buck Converter IC
Considering Input Filter to Reduce Conducted Emissions by DCDC Converter
Measurement Method for Phase Margin with Frequency Response Analyzer (FRA)
Capacitor Calculation for Buck converter IC
Considering Polarity of Power Inductor to Reduce Radiated Emission of DC-DC converter
Five Steps for Successful Thermal Design of IC
Precautions for PCB Layout Regarding Common Mode Filters
Resistor Value Table to set Output Voltage of Buck Converter IC
PCB Layout Thermal Design Guide
Considerations for Power Inductors Used for Buck Converters
Heat Dissipation Effect of Thermal Via in Exposed Pad Type Package
Method for Calculating Junction Temperature from Transient Thermal Resistance Data
The Important Points of Multi-layer Ceramic Capacitor Used in Buck Converter circuit
PCB Layout Techniques of Buck Converter
How to Use the Thermal Resistance and Thermal Characteristics Parameters
Types of Capacitors Used for Output Smoothing of Switching Regulators and their Precautions
θ<sub>JA</sub> and Ψ<sub>JT</sub>
Solder Joint Rate and Thermal Resistance of Exposed Pad
Diode Selection Method for Asynchronous Converter
Power Supply Sequence Circuit with General Purpose Power Supply IC
What Is Thermal Design
How to Use the Two-Resistor Model
Calculation of Power Dissipation in Switching Circuit
Phase Compensation Design for Current Mode Buck Converter
Suppression Method of Switching Noise Using Linear Regulator and Low Pass Filter
Design Guide and Example of Stencil for Exposed Pad
Thermal Resistance
Method for Determining Constants of Peripheral Parts of Buck DC/DC Converter
Three Steps for Successful Design of DC-DC Converters
θ<sub>JC</sub> and Ψ<sub>JT</sub>
Step-down DC-DC converter PCB layout EMC Design guide
Inductor Calculation for Buck converter IC
Calculation of Power Loss (Synchronous)
Cutting-Edge Web Simulation Tool "ROHM Solution Simulator" Capable of Complete Circuit Verification of Power Devices and Driver ICs