Part	Number of Positions	Contact Finish Thickness - Mating	Termination	Material Flammability Rating	Contact Finish - Mating	Insulation Material	Features	Contact Length - Mating	Contact Finish - Post	Pitch - Mating	Number of Rows	Insulation Height	Number of Positions Loaded	Contact Material	Style	Operating Temperature (Max)	Operating Temperature (Min)	Current Rating (Per Contact)	Mounting Type	Insulation Color	Connector Type	Fastening Type	Contact Type	Contact Shape	Row Spacing - Mating	Shrouding	Contact Finish Thickness - Post	Overall Contact Length	Contact Length - Post
Samtec Inc. HTST-113-01-H-DV	26	30 µin	Solder	UL94 V-0	Gold	Liquid Crystal Polymer (LCP)	Keying Slot	0.25 in	Gold	0.1 in	2	0.35 in	All	Phosphor Bronze	Board Cable/Wire	125 °C	-55 °C	3.4 A	Surface Mount	Natural	Header	Push-Pull	Male Pin	Square	0.1 in	Shrouded - 4 Wall	3 µin
Samtec Inc. HTST-113-01-LM-D	26	10 µin	Solder	UL94 V-0	Gold	Liquid Crystal Polymer (LCP)	Keying Slot	0.25 in	Tin	0.1 in	2	0.35 in	All	Phosphor Bronze	Board Cable/Wire	125 °C	-55 °C	3.4 A	Through Hole	Natural	Header	Push-Pull	Male Pin	Square	0.1 in	Shrouded - 4 Wall		0.48 in	0.115 in
Samtec Inc. HTST-113-04-L-D-RA	26	10 µin	Solder	UL94 V-0	Gold	Liquid Crystal Polymer (LCP)	Keying Slot	0.25 in	Tin	0.1 in	2	0.365 in	All	Phosphor Bronze	Board Cable/Wire	125 °C	-55 °C	3.4 A	Right Angle Through Hole	Natural	Header	Push-Pull	Male Pin	Square	0.1 in	Shrouded - 4 Wall			0.13 in
Samtec Inc. HTST-113-04-T-D-RA	26		Solder	UL94 V-0	Tin	Liquid Crystal Polymer (LCP)	Keying Slot	0.25 in	Tin	0.1 in	2	0.365 in	All	Phosphor Bronze	Board Cable/Wire	105 °C	-55 °C	3.4 A	Right Angle Through Hole	Natural	Header	Push-Pull	Male Pin	Square	0.1 in	Shrouded - 4 Wall			0.13 in
Samtec Inc. HTST-113-01-L-DV-P	26	10 µin	Solder	UL94 V-0	Gold	Liquid Crystal Polymer (LCP)	Keying Slot Pick and Place	0.25 in	Tin	0.1 in	2	0.35 in	All	Phosphor Bronze	Board Cable/Wire	125 °C	-55 °C	3.4 A	Surface Mount	Natural	Header	Push-Pull	Male Pin	Square	0.1 in	Shrouded - 4 Wall
Samtec Inc. HTST-113-01-F-DV-P	26	3 µin	Solder	UL94 V-0	Gold	Liquid Crystal Polymer (LCP)	Keying Slot Pick and Place	0.25 in	Tin	0.1 in	2	0.35 in	All	Phosphor Bronze	Board Cable/Wire	125 °C	-55 °C	3.4 A	Surface Mount	Natural	Header	Push-Pull	Male Pin	Square	0.1 in	Shrouded - 4 Wall
Samtec Inc. HTST-113-01-L-D	26	10 µin	Solder	UL94 V-0	Gold	Liquid Crystal Polymer (LCP)	Keying Slot	0.25 in	Tin	0.1 in	2	0.35 in	All	Phosphor Bronze	Board Cable/Wire	125 °C	-55 °C	3.4 A	Through Hole	Natural	Header	Push-Pull	Male Pin	Square	0.1 in	Shrouded - 4 Wall		0.48 in	0.115 in
Samtec Inc. HTST-113-04-G-D-RA	26	10 µin	Solder	UL94 V-0	Gold	Liquid Crystal Polymer (LCP)	Keying Slot	0.25 in	Gold	0.1 in	2	0.365 in	All	Phosphor Bronze	Board Cable/Wire	125 °C	-55 °C	3.4 A	Right Angle Through Hole	Natural	Header	Push-Pull	Male Pin	Square	0.1 in	Shrouded - 4 Wall	3 µin		0.13 in
Samtec Inc. HTST-113-01-TM-DV
Samtec Inc. HTST-113-01-F-DV	26	3 µin	Solder	UL94 V-0	Gold	Liquid Crystal Polymer (LCP)	Keying Slot	0.25 in	Tin	0.1 in	2	0.35 in	All	Phosphor Bronze	Board Cable/Wire	125 °C	-55 °C	3.4 A	Surface Mount	Natural	Header	Push-Pull	Male Pin	Square	0.1 in	Shrouded - 4 Wall

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HTST-113-01-TM-DV | Datasheet