Specification	HTMS-125-02-G-D

Connector Type	Header
Contact Finish - Mating	Gold
Contact Finish - Post	Gold
Contact Material	Phosphor Bronze
Contact Shape	Square
Contact Type	Male Pin
Fastening Type	Push-Pull
Insulation Color	Black
Insulation Material	Liquid Crystal Polymer (LCP)
Material Flammability Rating	UL94 V-0
Mounting Type	Through Hole
Number of Positions	50
Number of Rows	2
Operating Temperature (Max)	125 °C
Operating Temperature (Min)	-55 °C
Pitch - Mating	0.05 in
Shrouding	Unshrouded
Style	Board
Termination	Solder

HTMS-125 Series

Part	Insulation Color	Connector Type	Shrouding	Fastening Type	Contact Finish - Post	Operating Temperature (Max)	Operating Temperature (Min)	Contact Finish - Mating	Contact Material	Termination	Style	Mounting Type	Number of Positions	Insulation Material	Pitch - Mating	Contact Shape	Material Flammability Rating	Number of Rows	Contact Type	Overall Contact Length	Contact Length - Post	Insulation Height	Current Rating (Per Contact)	Contact Finish Thickness - Mating	Contact Length - Mating	Row Spacing - Mating	Number of Positions Loaded	Contact Finish Thickness - Post
Samtec Inc. HTMS-125-02-S-D	Black	Header	Unshrouded	Push-Pull	Tin	125 °C	-55 °C	Gold	Phosphor Bronze	Solder	Board	Through Hole	50	Liquid Crystal Polymer (LCP)	0.05 in	Square	UL94 V-0	2	Male Pin
Samtec Inc. HTMS-125-53-S-D	Black	Header	Unshrouded	Push-Pull	Tin	125 °C	-55 °C	Gold	Phosphor Bronze	Solder	Board	Through Hole	50	Liquid Crystal Polymer (LCP)	0.05 in	Square	UL94 V-0	2	Male Pin	0.505 in	0.12 in	0.1 in	5 A	30 µin	0.285 in	0.1 in	All
Samtec Inc. HTMS-125-01-S-S-SM	Black	Header	Unshrouded	Push-Pull	Tin	125 °C	-55 °C	Gold	Phosphor Bronze	Solder	Board	Surface Mount	25	Liquid Crystal Polymer (LCP)	0.05 in	Square	UL94 V-0	1	Male Pin			0.1 in	5 A	30 µin	0.23 in		All
Samtec Inc. HTMS-125-51-T-S	Black	Header	Unshrouded	Push-Pull	Tin	105 °C	-55 °C	Tin	Phosphor Bronze	Solder	Board	Through Hole	25	Liquid Crystal Polymer (LCP)	0.05 in	Square	UL94 V-0	1	Male Pin	0.41 in	0.12 in	0.1 in	5 A		0.19 in		All
Samtec Inc. HTMS-125-02-G-D	Black	Header	Unshrouded	Push-Pull	Gold	125 °C	-55 °C	Gold	Phosphor Bronze	Solder	Board	Through Hole	50	Liquid Crystal Polymer (LCP)	0.05 in	Square	UL94 V-0	2	Male Pin
Samtec Inc. HTMS-125-01-S-D-SM	Black	Header	Unshrouded	Push-Pull	Tin	125 °C	-55 °C	Gold	Phosphor Bronze	Solder	Board	Surface Mount	50	Liquid Crystal Polymer (LCP)	0.05 in	Square	UL94 V-0	2	Male Pin
Samtec Inc. HTMS-125-51-G-S	Black	Header	Unshrouded	Push-Pull	Gold	125 °C	-55 °C	Gold	Phosphor Bronze	Solder	Board	Through Hole	25	Liquid Crystal Polymer (LCP)	0.05 in	Square	UL94 V-0	1	Male Pin	0.41 in	0.12 in	0.1 in	5 A	10 µin	0.19 in		All	3 µin
Samtec Inc. HTMS-125-51-L-S	Black	Header	Unshrouded	Push-Pull	Tin	125 °C	-55 °C	Gold	Phosphor Bronze	Solder	Board	Through Hole	25	Liquid Crystal Polymer (LCP)	0.05 in	Square	UL94 V-0	1	Male Pin	0.41 in	0.12 in	0.1 in	5 A	10 µin	0.19 in		All
Samtec Inc. HTMS-125-01-F-D	Black	Header	Unshrouded	Push-Pull	Tin	125 °C	-55 °C	Gold	Phosphor Bronze	Solder	Board	Through Hole	50	Liquid Crystal Polymer (LCP)	0.05 in	Square	UL94 V-0	2	Male Pin	0.45 in	0.12 in	0.1 in	5 A	3 µin	0.23 in	0.1 in	All
Samtec Inc. HTMS-125-01-G-D-SM-P-TR	Black	Header	Unshrouded	Push-Pull	Gold	125 °C	-55 °C	Gold	Phosphor Bronze	Solder	Board	Surface Mount	50	Liquid Crystal Polymer (LCP)	0.05 in	Square	UL94 V-0	2	Male Pin			0.1 in	5 A	10 µin	0.23 in	0.1 in	All	3 µin

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HTMS-125-02-G-D | Datasheet