
BU7250G-TR
ActiveRohm Semiconductor
ANALOG COMPARATORS INPUT FULL SWING, OPEN DRAIN OUTPUT LOW SUPPLY CURRENT CMOS COMPARATOR

BU7250G-TR
ActiveRohm Semiconductor
ANALOG COMPARATORS INPUT FULL SWING, OPEN DRAIN OUTPUT LOW SUPPLY CURRENT CMOS COMPARATOR
Description
General part information
BU7250G Series
BU7250G is low supply current and open drain output comparators. These features low operating supply voltage of +1.8V to +5.5V, Low supply current and extremely low input bias current.
Technical Specifications
Parameters and characteristics for this part
| Specification | BU7250G-TR |
|---|---|
| CMRR (Typ) | 80 dB |
| Current - Input Bias (Max) | 1 pA |
| Current - Input Bias (Typ) | 1 pA |
| Current - Output (Typ) | 6 mA |
| Current - Quiescent (Max) | 35 µA |
| Mounting Type | Surface Mount |
| Number of Elements | 1 |
| Operating Temperature (Max) | 85 °C |
| Operating Temperature (Min) | -40 °C |
| Output Type | Open-Drain |
| Package Name | 5-SSOP |
| Propagation Delay (Max) | 750 ns |
| Propagation Delay (Typical) | 750 ns |
| PSRR (Typ) | 80 dB |
| Supply Configuration | Dual, Single |
| Type | CMOS |
| Voltage - Input Offset (Max) | 11 mV |
| Voltage - Supply (Dual) Maximum (Magnitude) | 2.75 V |
| Voltage - Supply (Dual) Minimum (Magnitude) | 0.9 V |
| Voltage - Supply (Single) Maximum | 5.5 V |
| Voltage - Supply (Single) Minimum | 1.8 V |
Pricing
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CAD
3D models and CAD resources for this part
Documents
Technical documentation and resources
Anti-Whisker formation
BU7250G Data Sheet
Basics of Thermal Resistance and Heat Dissipation
Op-Amp / Comparator Tutorial
Heat Dissipation Effect of Thermal Via in Exposed Pad Type Package
SSOP5 Package Information
Five Steps for Successful Thermal Design of IC
Compliance with the ELV directive
Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)
Factory Information
Design Guide and Example of Stencil for Exposed Pad
Method for Calculating Junction Temperature from Transient Thermal Resistance Data
Impedance Characteristics of Bypass Capacitor
UL94 Flame Classifications of Mold Compound
Thermal Resistance
Solder Joint Rate and Thermal Resistance of Exposed Pad
What Is Thermal Design