PMDPB30XNAX

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Nexperia USA Inc.

20 V, DUAL N-CHANNEL TRENCH MOSFET

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PMDPB30XNAX

Active

Nexperia USA Inc.

20 V, DUAL N-CHANNEL TRENCH MOSFET

Find alt

Alpha

Description Specifications Series Pricing CAD Documents

Description

General part information

PMDPB30XNA Series

Dual N-channel enhancement mode Field-Effect Transistor (FET) in a small and leadless ultra thin DFN2020-6 (SOT1118) Surface-Mounted Device (SMD) plastic package using Trench MOSFET technology.

Technical Specifications

Parameters and characteristics for this part

Specification	PMDPB30XNAX

Channel Count	2
Configuration	N-Channel
Configuration - Features	Dual
Current - Continuous Drain (Id) (Ta)	4.5 A
Current - Continuous Drain (Id) (Tc)	12 A
Drain to Source Voltage (Vdss)	20 V
Gate Charge (Max)	10 nC
Grade	Automotive
Input Capacitance (Ciss) (Max)	619 pF
Mounting Type	Surface Mount
Operating Temperature (Max)	150 °C
Operating Temperature (Min)	-55 °C
Package / Case	6-UFDFN Exposed Pad
Package Length	2 mm
Package Name	6-HUSON
Package Width	2 mm
Power - Max (Ta)	640 mW
Power - Max (Tc)	11 W
Qualification	AEC-Q101
Rds On (Max)	34 mOhm
Technology	MOSFET (Metal Oxide)

PMDPB30XNA Series

20 V, dual N-channel Trench MOSFET

Part	Gate Charge (Max)	Input Capacitance (Ciss) (Max)	Power - Max (Ta)	Power - Max (Tc)	Drain to Source Voltage (Vdss)	Qualification	Grade	Technology	Mounting Type	Package / Case	Current - Continuous Drain (Id) (Ta)	Current - Continuous Drain (Id) (Tc)	Rds On (Max)	Operating Temperature (Min)	Operating Temperature (Max)	Package Length	Package Name	Package Width	Channel Count	Configuration	Configuration - Features
Nexperia USA Inc. PMDPB30XNAX	10 nC	619 pF	640 mW	11 W	20 V	AEC-Q101	Automotive	MOSFET (Metal Oxide)	Surface Mount	6-UFDFN Exposed Pad	4.5 A	12 A	34 mOhm	-55 °C	150 °C	2 mm	6-HUSON	2 mm	2	N-Channel	Dual

Pricing

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CAD

3D models and CAD resources for this part

Documents

Technical documentation and resources

Datasheet

Nexperia package poster

Questions about package outline drawings

Thermal performance of DFN packages

plastic, thermal enhanced ultra thin small outline package; no leads; 6 terminals; 0.65 mm pitch; 2 mm x 2 mm x 0.65 mm body

DFN2020-6; Reel pack for SMD, 7''; Q2/T3 product orientation

plastic, leadless thermal enhanced ultra thin small outline package; no leads; 6 terminals; 0.65 mm pitch; 2 mm x 2 mm x 0.65 mm body

Reflow soldering profile