
BU7464F-E2
ActiveRohm Semiconductor
HIGH SPEED GROUND SENSE OPERATIONAL AMPLIFIER

BU7464F-E2
ActiveRohm Semiconductor
HIGH SPEED GROUND SENSE OPERATIONAL AMPLIFIER
Description
General part information
BU7464 Series
Low Voltage CMOS Op-Amp integrates one or two independent outputs full swing Op-Amps and phase compensation capacitors on a single chip. Especially, this series is operable with low voltage, low supply current and low input bias current.
Technical Specifications
Parameters and characteristics for this part
| Specification | BU7464F-E2 |
|---|---|
| Amplifier Type | CMOS |
| Current - Input Bias | 1 pA |
| Current - Output / Channel | 12 mA |
| Current - Supply | 600 µA |
| Gain Bandwidth Product | 1 MHz |
| Mounting Type | Surface Mount |
| Number of Circuits | 4 |
| Operating Temperature (Max) | 85 °C |
| Operating Temperature (Min) | -40 °C |
| Package Length | 0.173 in |
| Package Name | 14-SOIC, 14-SOP |
| Package Width | 4.4 mm |
| Slew Rate | 1 V/µs |
| Voltage - Input Offset | 1 mV |
| Voltage - Supply Span (Max) | 5.5 V |
| Voltage - Supply Span (Min) | 1.7 V |
Pricing
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CAD
3D models and CAD resources for this part
Documents
Technical documentation and resources
Datasheet
Heat Dissipation Effect of Thermal Via in Exposed Pad Type Package
Op-Amp / Comparator Tutorial
SOP14 Package Information
Solder Joint Rate and Thermal Resistance of Exposed Pad
Impedance Characteristics of Bypass Capacitor
Design Guide and Example of Stencil for Exposed Pad
Five Steps for Successful Thermal Design of IC
Compliance with the ELV directive
Factory Information
Thermal Resistance
Basics of Thermal Resistance and Heat Dissipation
UL94 Flame Classifications of Mold Compound
Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)
Method for Calculating Junction Temperature from Transient Thermal Resistance Data
Op amp Circuit Collection
Anti-Whisker formation
What Is Thermal Design
Low-Side Current Sensing Circuit Design