RB160MM-60TFTR
ActiveRohm Semiconductor
SCHOTTKY BARRIER DIODE (AEC-Q101 QUALIFIED)
RB160MM-60TFTR
ActiveRohm Semiconductor
SCHOTTKY BARRIER DIODE (AEC-Q101 QUALIFIED)
Description
General part information
RB160 Series
RB160MM-60TF is the high reliability Automotive Schottky Barrier Diode, suitable for general rectification.
Technical Specifications
Parameters and characteristics for this part
| Specification | RB160MM-60TFTR |
|---|---|
| Current - Average Rectified (Io) | 1 A |
| Current - Reverse Leakage | 50 µA |
| Grade | Automotive |
| Mounting Type | Surface Mount |
| Operating Temperature - Junction (Max) | 150 °C |
| Package / Case | SOD-123F |
| Package Name | PMDU |
| Qualification | AEC-Q101 |
| Speed - Fast Recovery (Maximum) | 500 ns |
| Speed - Fast Recovery (Minimum) | 200 mA |
| Technology | Schottky |
| Voltage - DC Reverse (Vr) (Max) | 60 V |
| Voltage - Forward (Vf) (Max) | 550 mV |
Pricing
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CAD
3D models and CAD resources for this part
Documents
Technical documentation and resources
What is a Thermal Model? (Diode)
What Is Thermal Design
Moisture Sensitivity Level - Diodes
How to Use LTspice® Models: Tips for Improving Convergence
About Flammability of Materials
Advantages of PMDE Compact Package with High Heat Dissipation for Automotive Schottky Barrier Diodes
Diode Types and Applications
Inner Structure
Package Dimensions
Basics of Thermal Resistance and Heat Dissipation
θ<sub>JC</sub> and Ψ<sub>JT</sub>
θ<sub>JA</sub> and Ψ<sub>JT</sub>
Anti-Whisker formation - Diodes
Part Explanation
Diode Selection Method for Asynchronous Converter
Condition of Soldering / Land Pattern Reference
Notes for Calculating Power Consumption:Static Operation
List of Diode Package Thermal Resistance
How to Select Rectifier Diodes
ROHM's SBD Lineup Contributes to Greater Miniaturization and Lower Loss in Automotive, Industrial, and Consumer Equipment
Explanation for Marking
Taping Information
How to Select Reverse Current Protection Diodes for LDO Regulators
Absolute Maximum Rating and Electrical Characteristics of Diodes
Reliability Test Result
Precautions When Measuring the Rear of the Package with a Thermocouple
PCB Layout Thermal Design Guide
Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)
Two-Resistor Model for Thermal Simulation
Judgment Criteria of Thermal Evaluation
Constitution Materials List
How to Use LTspice® Models
Compliance of the RoHS directive
Impedance Characteristics of Bypass Capacitor
Power Loss and Thermal Design of Diodes
RB160MM-60TF Data Sheet
Notes for Temperature Measurement Using Thermocouples
About Export Regulations
Method for Monitoring Switching Waveform
RB160MM-60TF ESD Data
How to Use the Thermal Resistance and Thermal Characteristics Parameters
Method for Calculating Junction Temperature from Transient Thermal Resistance Data
Importance of Probe Calibration When Measuring Power: Deskew
Measurement Method and Usage of Thermal Resistance RthJC
Notes for Temperature Measurement Using Forward Voltage of PN Junction
Report of SVHC under REACH Regulation
