PMEG60T50ELP-QX
ActiveNexperia USA Inc.
60 V, 5 A LOW LEAKAGE CURRENT TRENCH MEGA SCHOTTKY BARRIER RECTIFIER
PMEG60T50ELP-QX
ActiveNexperia USA Inc.
60 V, 5 A LOW LEAKAGE CURRENT TRENCH MEGA SCHOTTKY BARRIER RECTIFIER
Description
General part information
PMEG60T50ELP-Q Series
Trench Maximum Efficiency General Application (MEGA) Schottky barrier rectifier encapsulated in a CFP5 (SOD128) small and flat lead Surface-Mounted Device (SMD) plastic package.
Technical Specifications
Parameters and characteristics for this part
| Specification | PMEG60T50ELP-QX |
|---|---|
| Capacitance | 560 pF |
| Current - Average Rectified (Io) | 5 A |
| Current - Reverse Leakage | 1.8 µA |
| Grade | Automotive |
| Mounting Type | Surface Mount |
| Operating Temperature - Junction | 175 °C |
| Package / Case | SOD-128 |
| Package Name | SOD-128/CFP5 |
| Qualification | AEC-Q101 |
| Reverse Recovery Time (trr) | 16 ns |
| Speed - Fast Recovery (Maximum) | 500 ns |
| Speed - Fast Recovery (Minimum) | 200 mA |
| Technology | Schottky |
| Voltage - DC Reverse (Vr) (Max) | 60 V |
| Voltage - Forward (Vf) (Max) | 690 mV |
Pricing
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CAD
3D models and CAD resources for this part
Documents
Technical documentation and resources
Datasheet
PMEG60T50ELP-Q Nexperia Product Reliability
Wave soldering profile
Schottky rectifiers in CFP packages
Reflow soldering profile
plastic, surface mounted package; 2 terminals; 4 mm pitch; 3.8 mm x 2.6 mm x 1 mm body
Nexperia package poster
plastic, surface mounted package; 2 terminals; 4 mm pitch; 3.8 mm x 2.6 mm x 1 mm body
Evaluation of junction temperature and thermal stacks using the virtual junction
Questions about package outline drawings
CFP封装的肖特基整流器
Wave soldering guidelines for flatpack packages
Reel pack for SMD, 7''; Q1/T1-Q2/T3 product orientation