Specification	TEM-110-02-07.0-H-D-K-TR

Connector Type	Header
Contact Finish - Mating	Gold
Contact Finish - Post	Gold
Contact Finish Thickness - Mating	30 µin
Contact Material	Phosphor Bronze
Contact Shape	Square
Contact Type	Male Pin
Current Rating (Per Contact)	2.9 A
Fastening Type	Push-Pull
Features	Pick and Place
Insulation Color	Black
Insulation Height	0.378 in
Insulation Material	Liquid Crystal Polymer (LCP)
Mounting Type	Surface Mount
Number of Positions	20
Number of Positions Loaded	All
Number of Rows	2
Operating Temperature (Max)	125 °C
Operating Temperature (Min)	-55 °C
Pitch - Mating	0.031 in
Row Spacing - Mating	0.063 in
Shrouding	Shrouded - 4 Wall
Style	Board
Termination	Solder

TEM Series

Part	Shrouding	Contact Material	Insulation Height	Contact Shape	Insulation Material	Pitch - Mating	Style	Number of Rows	Contact Finish - Post	Number of Positions Loaded	Contact Finish - Mating	Connector Type	Operating Temperature (Max)	Operating Temperature (Min)	Row Spacing - Mating	Mounting Type	Current Rating (Per Contact)	Contact Type	Contact Finish Thickness - Mating	Insulation Color	Termination	Fastening Type	Number of Positions	Features	Contact Length - Mating	Mated Stacking Height	Contact Finish Thickness - Post
Samtec Inc. TEM-110-02-07.0-H-D-TR	Shrouded - 4 Wall	Phosphor Bronze	0.378 in	Square	Liquid Crystal Polymer (LCP)	0.031 in	Board	2	Gold	All	Gold	Header	125 °C	-55 °C	0.063 in	Surface Mount	2.9 A	Male Pin	30 µin	Black	Solder	Push-Pull	20
Samtec Inc. TEM-110-02-DH1-F-D-A	Shrouded - 4 Wall	Phosphor Bronze	0.236 in	Square	Liquid Crystal Polymer (LCP)	0.031 in	Board	2	Tin	All	Gold	Header	125 °C	-55 °C	0.063 in	Right Angle Surface Mount	2.9 A	Male Pin	3 µin	Black	Solder	Push-Pull	20	Board Guide	0.116 in
Samtec Inc. TEM-105-02-03.0-G-D-L1-TR	Shrouded - 4 Wall	Phosphor Bronze	0.22 in	Square	Liquid Crystal Polymer (LCP)	0.031 in	Board	2	Gold	All	Gold	Header	125 °C	-55 °C	0.063 in	Surface Mount	2.9 A	Male Pin	10 µin	Black	Solder	Latch Lock	10
Samtec Inc. TEM-145-02-04.0-G-D-WT	Shrouded - 4 Wall	Phosphor Bronze	0.26 in	Square	Liquid Crystal Polymer (LCP)	0.031 in	Board	2	Gold	All	Gold	Header	125 °C	-55 °C	0.063 in	Surface Mount	2.9 A	Male Pin	10 µin	Black	Solder	Push-Pull	90	Solder Retention		7 mm	3 µin
Samtec Inc. TEM-130-02-07.0-H-D-K	Shrouded - 4 Wall	Phosphor Bronze	0.378 in	Square	Liquid Crystal Polymer (LCP)	0.031 in	Board	2	Gold	All	Gold	Header	125 °C	-55 °C	0.063 in	Surface Mount	2.9 A	Male Pin	30 µin	Black	Solder	Push-Pull	60	Pick and Place		10 mm	3 µin
Samtec Inc. TEM-130-02-07.0-H-D-A-K	Shrouded - 4 Wall	Phosphor Bronze	0.378 in	Square	Liquid Crystal Polymer (LCP)	0.031 in	Board	2	Gold	All	Gold	Header	125 °C	-55 °C	0.063 in	Surface Mount	2.9 A	Male Pin	30 µin	Black	Solder	Push-Pull	60	Board Guide Pick and Place
Samtec Inc. TEM-150-02-DH1-F-D	Shrouded - 4 Wall	Phosphor Bronze	0.236 in	Square	Liquid Crystal Polymer (LCP)	0.031 in	Board	2	Tin	All	Gold	Header	125 °C	-55 °C	0.063 in	Right Angle Surface Mount	2.9 A	Male Pin	3 µin	Black	Solder	Push-Pull	100		0.116 in
Samtec Inc. TEM-115-02-DH1-S-D-A	Shrouded - 4 Wall	Phosphor Bronze	0.236 in	Square	Liquid Crystal Polymer (LCP)	0.031 in	Board	2	Tin	All	Gold	Header	125 °C	-55 °C	0.063 in	Right Angle Surface Mount	2.9 A	Male Pin	30 µin	Black	Solder	Push-Pull	30	Board Guide	0.116 in
Samtec Inc. TEM-105-02-04.0-H-D-WT	Shrouded - 4 Wall	Phosphor Bronze	0.26 in	Square	Liquid Crystal Polymer (LCP)	0.031 in	Board	2	Gold	All	Gold	Header	125 °C	-55 °C	0.063 in	Surface Mount	2.9 A	Male Pin	30 µin	Black	Solder	Push-Pull	10	Solder Retention
Samtec Inc. TEM-150-02-03.0-H-D-WT	Shrouded - 4 Wall	Phosphor Bronze	0.22 in	Square	Liquid Crystal Polymer (LCP)	0.031 in	Board	2	Gold	All	Gold	Header	125 °C	-55 °C	0.063 in	Surface Mount	2.9 A	Male Pin	30 µin	Black	Solder	Push-Pull	100	Solder Retention		6 mm	3 µin

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