Specification	MC9S12XDT512MAA

A/D Channels	8 count
A/D Resolution (bits)	10 bit
Connectivity	LINbus, I2C, SPI, EBI, EMI, IrDA, CANbus, SCI
Core Processor	HCS12X
Core Size (Bit Width)	16 Bit
EEPROM Size (Depth)	4 K
EEPROM Size (Width)	8 bit
Mounting Type	Surface Mount
Number of I/O	59
Operating Temperature (Max)	125 °C
Operating Temperature (Min)	-40 °C
Oscillator Type	External
Package / Case	80-QFP
Package Length	14 mm
Package Name	80-QFP
Package Width	14 mm
Peripherals	WDT, PWM, POR, LVD
Program Memory Depth	512 K
Program Memory Size	512 KB
Program Memory Type	FLASH
Program Memory Width	8 bit
RAM Size Depth	20 K
RAM Size Width	8 bit
Speed	80 MHz
Voltage - Supply (Vcc/Vdd) Maximum	5.5 V
Voltage - Supply (Vcc/Vdd) Minimum	2.35 V

S12XD Series

Part	Program Memory Type	Oscillator Type	Mounting Type	Package / Case	Core Size (Bit Width)	Operating Temperature (Max)	Operating Temperature (Min)	EEPROM Size (Width)	EEPROM Size (Depth)	Connectivity	Program Memory Width	Program Memory Size	Program Memory Depth	Number of I/O	RAM Size Width	RAM Size Depth	Peripherals	Voltage - Supply (Vcc/Vdd) Maximum	Voltage - Supply (Vcc/Vdd) Minimum	Package Length	Package Name	Package Width	Speed	Core Processor	A/D Resolution (bits)	A/D Channels
NXP USA Inc. MC9S12XDP512MAG	FLASH	External	Surface Mount	144-LQFP	16 Bit	125 °C	-40 °C	8 bit	4 K	CANbus EBI EMI I2C IrDA LINbus SCI SPI	8 bit	512 KB	512 K	119	8 bit	32 K	LVD POR PWM WDT	5.5 V	2.35 V	20 mm	144-LQFP	20 mm	80 MHz	HCS12X	10 bit	24 count
NXP USA Inc. MC9S12XDT512MAG	FLASH	External	Surface Mount	144-LQFP	16 Bit	125 °C	-40 °C	8 bit	4 K	CANbus EBI EMI I2C IrDA LINbus SCI SPI	8 bit	512 KB	512 K	119	8 bit	20 K	LVD POR PWM WDT	5.5 V	2.35 V	20 mm	144-LQFP	20 mm	80 MHz	HCS12X	10 bit	24 count
NXP USA Inc. MC9S12XDT512MAA	FLASH	External	Surface Mount	80-QFP	16 Bit	125 °C	-40 °C	8 bit	4 K	CANbus EBI EMI I2C IrDA LINbus SCI SPI	8 bit	512 KB	512 K	59	8 bit	20 K	LVD POR PWM WDT	5.5 V	2.35 V	14 mm	80-QFP	14 mm	80 MHz	HCS12X	10 bit	8 count

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