
BR24H16FVT-5ACE2
ActiveRohm Semiconductor
16KBIT, I²C BUS, HIGH SPEED WRITE CYCLE, HIGH ENDURANCE, SERIAL EEPROM FOR AUTOMOTIVE (125℃ OPERATION)

BR24H16FVT-5ACE2
ActiveRohm Semiconductor
16KBIT, I²C BUS, HIGH SPEED WRITE CYCLE, HIGH ENDURANCE, SERIAL EEPROM FOR AUTOMOTIVE (125℃ OPERATION)
Description
General part information
BR24H16FVT-5AC Series
BR24H16xxx-5AC Series is a 16Kbit serial EEPROM of I²C BUS Interface.
Technical Specifications
Parameters and characteristics for this part
| Specification | BR24H16FVT-5ACE2 |
|---|---|
| Clock Frequency | 1 MHz |
| Grade | Automotive |
| Memory Format | EEPROM |
| Memory Interface (Type) | I2C |
| Memory Size | 2 KB |
| Memory Type | Non-Volatile |
| Mounting Type | Surface Mount |
| Operating Temperature (Max) | 125 °C |
| Operating Temperature (Min) | -40 °C |
| Package Length | 0.173 in |
| Package Name | 8-TSSOP-B, 8-TSSOP |
| Package Width | 4.4 mm |
| Qualification | AEC-Q100 |
| Technology | EEPROM |
| Voltage - Supply (Maximum) | 5.5 V |
| Voltage - Supply (Minimum) | 1.7 V |
| Write Cycle Time - Page | 3.5 ms |
| Write Cycle Time - Word | 3.5 ms |
Pricing
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CAD
3D models and CAD resources for this part
Documents
Technical documentation and resources
Factory Information
Thermal Resistance
Heat Dissipation Effect of Thermal Via in Exposed Pad Type Package
Address and Page Configuration of I<sup>2</sup>C BUS EEPROM
BR24H16FVT-5AC Data Sheet
Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)
Basics of Thermal Resistance and Heat Dissipation
Impedance Characteristics of Bypass Capacitor
Solder Joint Rate and Thermal Resistance of Exposed Pad
What Is Thermal Design
Design Guide and Example of Stencil for Exposed Pad
TSSOP-B8 Package Information
Five Steps for Successful Thermal Design of IC
Method for Calculating Junction Temperature from Transient Thermal Resistance Data