117-83-430-41-005101

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Preci-Dip

CONN IC DIP SOCKET 30POS GOLD

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117-83-430-41-005101

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Preci-Dip

CONN IC DIP SOCKET 30POS GOLD

Deep-Dive with AI

Specifications Pricing Series Description Documents

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Bulk	1710	$ 1.97

Description

General part information

117-83 Series

30 (2 x 15) Pos DIP, 0.4" (10.16mm) Row Spacing Socket Gold Through Hole

Documents

Technical documentation and resources

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Technical Specifications

Parameters and characteristics commom to parts in this series

Specification	117-83-430-41-005101	117-83 Series

Contact Finish - Mating	Gold	Gold
Contact Finish - Post	Tin	Tin
Contact Finish Thickness - Mating	29.5 Áin	29.5 Áin
Contact Finish Thickness - Mating	0.75 Ám	0.75 Ám
Contact Material - Mating	Beryllium Copper	Beryllium Copper
Contact Material - Post [custom]	Brass	Brass
Contact Resistance	10 mOhm	10 mOhm
Current Rating (Amps)	1 A	1 A
Features	Open Frame	Open Frame
Housing Material	Glass Filled, Polyester, Polycyclohexylenedimethylene Terephthalate (PCT)	Glass Filled, Polyester, Polycyclohexylenedimethylene Terephthalate (PCT)
Material Flammability Rating	UL94 V-0	UL94 V-0
Mounting Type	Through Hole	Through Hole
Number of Positions or Pins (Grid)	30	16 - 68
Number of Positions or Pins (Grid)	-	2 x 16
Number of Positions or Pins (Grid)	-	32
Number of Positions or Pins (Grid) [custom]	2	2
Number of Positions or Pins (Grid) [custom]	15	15 - 20
Operating Temperature [Max]	125 °C	125 °C
Operating Temperature [Min]	-55 °C	-55 °C
Pitch - Mating	0.07 in	0.07 in
Pitch - Mating	1.78 mm	1.78 mm
Pitch - Post	0.07 in	0.07 in
Pitch - Post	1.78 mm	1.78 mm
Termination	Solder	Solder
Termination Post Length	3.18 mm	3.18 mm
Termination Post Length	0.125 in	0.125 in
Type	0.4 in	0.3 - 0.6 in
Type	10.16 mm	7.62 - 15.24 mm
Type	DIP	DIP

117-83 Series

CONN IC DIP SOCKET 56POS GOLD

Part	Current Rating (Amps)	Termination	Contact Material - Mating	Number of Positions or Pins (Grid)	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Termination Post Length	Termination Post Length	Type	Type	Type	Pitch - Post	Pitch - Post	Mounting Type	Contact Resistance	Contact Material - Post [custom]	Operating Temperature [Min]	Operating Temperature [Max]	Features	Housing Material	Contact Finish - Mating	Pitch - Mating	Pitch - Mating	Material Flammability Rating	Contact Finish - Post	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]
Preci-Dip 117-83-656-41-105101	1 A	Solder	Beryllium Copper	56	29.5 Áin	0.75 Ám	3.18 mm	0.125 in	DIP	0.6 in	15.24 mm	0.07 in	1.78 mm	Through Hole	10 mOhm	Brass	-55 °C	125 °C	Open Frame	Glass Filled, Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	Gold	0.07 in	1.78 mm	UL94 V-0	Tin
Preci-Dip 117-83-648-41-105101	1 A	Solder	Beryllium Copper	48	29.5 Áin	0.75 Ám	3.18 mm	0.125 in	DIP	0.6 in	15.24 mm	0.07 in	1.78 mm	Through Hole	10 mOhm	Brass	-55 °C	125 °C	Open Frame	Glass Filled, Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	Gold	0.07 in	1.78 mm	UL94 V-0	Tin
Preci-Dip 117-83-656-41-005101	1 A	Solder	Beryllium Copper	56	29.5 Áin	0.75 Ám	3.18 mm	0.125 in	DIP	0.6 in	15.24 mm	0.07 in	1.78 mm	Through Hole	10 mOhm	Brass	-55 °C	125 °C	Open Frame	Glass Filled, Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	Gold	0.07 in	1.78 mm	UL94 V-0	Tin
Preci-Dip 117-83-432-41-005101	1 A	Solder	Beryllium Copper		29.5 Áin	0.75 Ám	3.18 mm	0.125 in	DIP	0.4 in	10.16 mm	0.07 in	1.78 mm	Through Hole	10 mOhm	Brass	-55 °C	125 °C	Open Frame	Glass Filled, Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	Gold	0.07 in	1.78 mm	UL94 V-0	Tin	2 x 16	32
Preci-Dip 117-83-664-41-105101	1 A	Solder	Beryllium Copper	64	29.5 Áin	0.75 Ám	3.18 mm	0.125 in	DIP	0.6 in	15.24 mm	0.07 in	1.78 mm	Through Hole	10 mOhm	Brass	-55 °C	125 °C	Open Frame	Glass Filled, Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	Gold	0.07 in	1.78 mm	UL94 V-0	Tin
Preci-Dip 117-83-620-41-005101	1 A	Solder	Beryllium Copper	20	29.5 Áin	0.75 Ám	3.18 mm	0.125 in	DIP	0.6 in	15.24 mm	0.07 in	1.78 mm	Through Hole	10 mOhm	Brass	-55 °C	125 °C	Open Frame	Glass Filled, Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	Gold	0.07 in	1.78 mm	UL94 V-0	Tin
Preci-Dip 117-83-316-41-105101	1 A	Solder	Beryllium Copper	16	29.5 Áin	0.75 Ám	3.18 mm	0.125 in	DIP	0.3 "	7.62 mm	0.07 in	1.78 mm	Through Hole	10 mOhm	Brass	-55 °C	125 °C	Open Frame	Glass Filled, Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	Gold	0.07 in	1.78 mm	UL94 V-0	Tin
Preci-Dip 117-83-624-41-105101	1 A	Solder	Beryllium Copper	24	29.5 Áin	0.75 Ám	3.18 mm	0.125 in	DIP	0.6 in	15.24 mm	0.07 in	1.78 mm	Through Hole	10 mOhm	Brass	-55 °C	125 °C	Open Frame	Glass Filled, Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	Gold	0.07 in	1.78 mm	UL94 V-0	Tin
Preci-Dip 117-83-428-41-105101	1 A	Solder	Beryllium Copper	28	29.5 Áin	0.75 Ám	3.18 mm	0.125 in	DIP	0.4 in	10.16 mm	0.07 in	1.78 mm	Through Hole	10 mOhm	Brass	-55 °C	125 °C	Open Frame	Glass Filled, Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	Gold	0.07 in	1.78 mm	UL94 V-0	Tin
Preci-Dip 117-83-430-41-005101	1 A	Solder	Beryllium Copper	30	29.5 Áin	0.75 Ám	3.18 mm	0.125 in	DIP	0.4 in	10.16 mm	0.07 in	1.78 mm	Through Hole	10 mOhm	Brass	-55 °C	125 °C	Open Frame	Glass Filled, Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	Gold	0.07 in	1.78 mm	UL94 V-0	Tin			2	15